Electronic module having circuit boards and a plastic sealing ring that can be molded on by injection molding, in particular for a motor vehicle transmission control unit, and method for producing said electronic module
An electronic module has a first circuit board element, a second circuit board element, and a spacer. Together, the first circuit board element, the second circuit board element, and the spacer enclose a central cavity, in which components attached to the first circuit board element are accommodated. Respective annular circumferential microstructures are provided on a surface of the first circuit board element directed outward and on a surface of the second circuit board element directed outward, adjacent to an outer periphery of the first circuit board element. In this region, a sealing ring is formed, which has a form-closed connection to both the first and the second circuit board element by means of the microstructures of the first and the second circuit board element. The sealing ring can be made of a resistant plastic, which is molded on by injection molding in the liquid state in the region of the outer periphery of the first circuit board element and flows into recesses of the microstructures and, after the curing, forms the form-closed and sealing connection between the two circuit board elements and the sealing ring thereby formed.
1. A method for producing an electronic module, comprising:
providing a first circuit board element, a second circuit board element beneath the first circuit board element, and a spacer, the first circuit board element, the second circuit board element, and the spacer configured such that together they fully enclose a central cavity in which at least one electronic component of the first circuit board element is received;
forming a first microstructuring in a shape of a first ring on an upwardly directed surface of the first circuit board element without microstructuring entire upwardly directed surface of the first circuit board element, forming a second microstructuring in a shape of a second ring on an outer circumference of the first circuit board element, and forming a third microstructuring in a shape of a third ring located outside of the cavity next to the spacer on an upwardly directed surface of the second circuit board element without microstructuring entire upwardly directed surface of the second circuit board element outside of the cavity;
arranging the at least one electronic component on a surface of the first circuit board element facing toward the central cavity; and
forming a sealing ring along the outer circumference of the first circuit board element such that the sealing ring is connected with a form fit to the first microstructuring and the second microstructuring formed on the first circuit board element and is connected with a form fit to the third microstructuring formed on the second circuit board element.
2. The method as claimed in claim 1 , wherein forming the first microstructuring, the second microstructuring, and the third microstructuring includes at least one of laser structuring, chemical roughening, mechanical roughening and plasma roughening.
3. The method as claimed in claim 1 , wherein forming the sealing ring includes at least one of thermoplastic injection molding, thermoset injection molding, adhesive bonding and filling with an encapsulation compound.
4. The method as claimed in claim 1 , wherein forming the sealing ring includes forming the sealing ring without covering the entire upwardly directed surface of the first circuit board element with the sealing ring.