Adhesive film and flexible printed circuit board
An adhesive film includes: a resin film layer; and an adhesive layer laminated to the resin film layer, in which the adhesive layer includes an adhesive agent, the adhesive layer is in a B stage state, an oxygen transmission rate at 200° C. of the resin film layer, measured in accordance with JIS K7126-1, is 1.50×10 −10 cc·cm/cm 2 ·sec·cmHg or less, and a 3% thermal weight reduction temperature of the adhesive agent is 320° C. or higher.
1. An adhesive film comprising:
a resin film layer; and
an adhesive layer laminated to the resin film layer, wherein
the adhesive layer includes an adhesive agent,
the adhesive agent contains a fluorine-based rubber,
the adhesive layer is in a B stage state,
the resin film layer includes a liquid crystal polymer,
an oxygen transmission rate at 200° C. of the resin film layer, measured in accordance with JIS K7126-1, is 1.50×10 −10 cc·cm/cm 2 ·sec·cmHg or less, and
a 3% thermal weight reduction temperature of the adhesive agent is 320° C. or higher.
2. The adhesive film according to claim 1 , wherein the oxygen transmission rate is 1.00×10 −11 cc·cm/cm 2 ·sec·cmHg or less.
3. The adhesive film according to claim 1 , wherein
the fluorine-based rubber is a polymer or a copolymer of at least one monomer selected from the group consisting of vinyl fluoride, vinylidene fluoride, hexafluoropropene, and tetrafluoroethylene.
4. The adhesive film according to claim 3 , wherein
the fluorine-based rubber is a vinylidene fluoride-hexafluoropropene copolymer.
5. The adhesive film according to claim 1 , wherein
the fluorine-based rubber has an unsaturated bond.
6. The adhesive film according to claim 1 , wherein
the adhesive layer includes an inorganic filler.
7. The adhesive film according to claim 1 , wherein the adhesive agent consists of a polymer or copolymer of at least one monomer selected from the group consisting of vinyl fluoride, vinylidene fluoride, hexafluoropropene, and tetrafluoroethylene.