Ultrasonic bonding jig, bonding structure, and bonding method
An ultrasonic bonding jig includes: a base; and a protrusion portion which has a protrusion portion end surface approximately parallel to the base and which has a pair of first walls, the pair of first walls being disposed upright approximately perpendicular to the base from opposed sides of the protrusion portion end surface. A bonding structure includes a bonding portion of a metal plate and a base material. The bonding portion has a recessed portion with a closed bottom on a surface of the metal plate, and the recessed portion has a pair of walls approximately perpendicular to the surface of the metal plate.
1. An ultrasonic bonding jig comprising:
a base; and
a protrusion portion including
a protrusion portion end surface approximately parallel to the base,
a pair of opposing first walls being disposed upright approximately perpendicular to the base from opposed sides of the protrusion portion end surface, and
a pair of opposing second walls each disposed to form an inclined surface that extends from the protrusion portion end surface to the base, wherein
a length of the protrusion portion end surface between the opposing second walls is longer than a length of the protrusion portion end surface between the opposing first walls.
2. The ultrasonic bonding jig according to claim 1 , further comprising:
a protrusion group that includes a plurality of separated protrusion portions;
a flat portion among protrusions formed among the protrusion portions; and
an annular flat portion that surrounds the protrusion group.
3. An ultrasonic bonding method comprising:
stacking a metal plate and a base material;
pressing the metal plate to the base material by the ultrasonic bonding jig according to claim 1 ; and
vibrating the ultrasonic bonding jig in a direction parallel to the first walls.
4. The ultrasonic bonding method according to claim 3 , wherein
the metal plate is a thin single-layer metal plate, and
the base material is a single-layer metal plate thicker than the metal plate.
5. The ultrasonic bonding method according to claim 3 , wherein
the metal plate is a flexible circuit board, and
the base material is a busbar.