Flexible printed circuit board with connection terminal, and method for manufacturing the same
Provided is a flexible printed circuit board with connection terminal, including: a base film and a conductor layer provided on the base film, wherein the connection terminal includes a plurality of crimping pieces for fixing the connection terminal to the flexible printed circuit board, the crimping pieces penetrate the flexible printed circuit board by being crimped, and are bent in a direction opposite to a direction in which the crimping pieces penetrate the flexible printed circuit board, to bite into at least a part of the conductor layer, and the conductor layer is removed in a region of the conductor layer which the crimping pieces penetrate.
1. A flexible printed circuit board with connection terminal, the flexible printed circuit board comprising a base film and a conductor layer provided on the base film, wherein
the connection terminal includes a plurality of crimping pieces for fixing the connection terminal to the flexible printed circuit board,
the crimping pieces penetrate the flexible printed circuit board by being crimped, and are bent in a direction opposite to a direction in which the crimping pieces penetrate the flexible printed circuit board, to bite into at least a part of the conductor layer, and
the conductor layer includes through holes in a region of the conductor layer which the crimping pieces penetrate.
2. The flexible printed circuit board with connection terminal according to claim 1 , the flexible printed circuit board further comprising a cover film in a part of a region of the flexible printed circuit board, wherein
the cover film is bonded to the base film so as to sandwich the conductor layer, and
at least some of the crimping pieces bite into at least a part of the conductor layer without penetrating the cover film by being arranged in a region where the cover film is not provided of the flexible printed circuit board.
3. The flexible printed circuit board with connection terminal according to claim 2 , wherein at least some of the crimping pieces are arranged in a region where the cover film is provided of the flexible printed circuit board, and penetrates the cover film to bite into at least the part of the conductor layer.
4. The flexible printed circuit board with connection terminal according to claim 3 , wherein at least some of the crimping pieces are arranged across both the region where the cover film is provided and the region where the cover film is not provided of the flexible printed circuit board, and only a portion of the crimping piece located in the region where the cover film is provided penetrates the cover film.
5. The flexible printed circuit board with connection terminal according to claim 1 , the flexible printed circuit board further comprising an insulating reinforcing film, wherein
the insulating reinforcing film is partially provided integrally with the base film in a region of the base film which the crimping pieces penetrate.
6. The flexible printed circuit board with connection terminal according to claim 1 , wherein in a state where the connection terminal is fixed to the flexible printed circuit board by the crimping pieces, at least a part of a portion exposed from the flexible printed circuit board of the crimping pieces is covered with a resin material.
7. The flexible printed circuit board with connection terminal according to claim 1 , wherein the flexible printed circuit board is a single-sided copper-clad laminate in which the base film is made of polyimide, polyethylene naphthalate, or polyethylene terephthalate.
8. A method for manufacturing a flexible printed circuit board with connection terminal, the method comprising:
providing a conductor layer on a base film included in the flexible printed circuit board;
forming through holes in a predetermined regions of the conductor layer; and
fixing the connection terminal to the flexible printed circuit board by crimping a crimping piece included in the connection terminal so as to penetrate the through holes in the predetermined regions of the conductor layer.