IP Library Granted Patent US 10,499,497
Granted Patent B2
US 10,499,497 · App. 16/194,422 · Granted Dec 3, 2019

Stretchable circuit board and stretchable circuit board manufacturing method

Inventor: Masayuki Iwase (Tokyo, JP)
Assignee: NIPPON MEKTRON, LTD.
H05K1/0283H05K1/0393H05K1/092H05K1/147H05K2201/0133H05K2201/2009
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Quick Facts
Patent No.
US 10,499,497
App. No.
16/194,422
Granted
Dec 3, 2019
Kind
B2
Abstract

Provided is a stretchable circuit board including: a stretchable base material having stretchability and including a stretchable wiring line on one main surface; an electrode formed on at least the main surface of the stretchable base material and connected to the stretchable wiring line; an adhesive layer directly or indirectly bonded to the main surface on which the electrode is formed and formed in a region of the main surface other than an electrode region including the electrode; and an adhesive layer separator detachably bonded to the adhesive layer and having an opening formed at a position corresponding to at least part of the electrode region.

Claims (16)

1. A stretchable circuit board comprising:

a stretchable base material having stretchability and including a stretchable wiring line on one main surface;

an electrode formed on at least the main surface of the stretchable base material and connected to the stretchable wiring line;

an adhesive layer directly or indirectly bonded to the main surface on which the electrode is formed and formed in a region of the main surface other than an electrode region including the electrode; and

an adhesive layer separator detachably bonded to the adhesive layer and having an opening formed at a position corresponding to at least part of the electrode region.

2. The stretchable circuit board according to claim 1 , wherein

at least part of the electrode region is exposed through the opening of the adhesive layer separator.

3. The stretchable circuit board according to claim 1 , wherein

the stretchable base material has a cover member formed between the main surface of the stretchable base material and the adhesive layer.

4. The stretchable circuit board according to claim 1 , further comprising:

a stretchable base material separator directly or indirectly bonded to a back surface of the main surface of the stretchable base material,

wherein adhesive force between the adhesive layer separator and the adhesive layer is smaller than adhesive force between the stretchable base material and the stretchable base material separator.

5. The stretchable circuit board according to claim 1 , wherein

the adhesive layer separator has a cut groove extending from a surface on an adhesive layer side to a surface on the other side at a boundary between a region where the adhesive layer is formed and a region where no adhesive layer is formed.

6. The stretchable circuit board according to claim 1 , further comprising:

a packing material configured to separately embed the stretchable circuit board.

Assignments (2)
CHANGE OF NAME Recorded Nov 30, 2024
From: NIPPON MEKTRON, LTD.
To: MEKTEC CORPORATION
Reel/Frame 069464/0771 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 19, 2018
From: IWASE, MASAYUKI
To: NIPPON MEKTRON, LTD.
Reel/Frame 047535/0306 →
Priority Claims (1)
JP 2017-227136 · Nov 27, 2017 · national
Continuity (1)
Related Publication 20190166689A1 · May 30, 2019