Component mount board

1. A component mount board comprising:

a board having a base, a first conductive pattern formed on the base, a mount component electrically connected to the first conductive pattern, and a soluble layer; and

a second conductive pattern,

wherein the soluble layer is soluble in liquid, and the second conductive pattern is soluble in liquid or is weakened when getting wet with liquid,

the base has, in a portion of the base corresponding to the second conductive pattern, a first missing portion where the base is missing,

the first conductive pattern has a first portion and a second portion separated from the first portion through the first missing portion,

the second conductive pattern connects, over the first missing portion, the first and second portions of the first conductive pattern to each other, and

a portion of the second conductive pattern at least over the first missing portion is formed on a first surface of the soluble layer.

2. The component mount board according to claim 1 , wherein

a width dimension of the first missing portion is 1.5 mm or less.

3. The component mount board according to claim 1 , wherein

the first surface of the soluble layer is a surface of the soluble layer opposite to a base side.

4. The component mount board according to claim 3 , further comprising:

a double-sided tape,

wherein the double-sided tape is arranged around the first missing portion on the base and the first conductive pattern, and

a second surface, which is a base-side surface, of the soluble layer is bonded to the base and the first conductive pattern with the double-sided tape.

5. The component mount board according to claim 3 , further comprising:

an adhesive layer,

wherein the adhesive layer is soluble in liquid, and is arranged over the first missing portion on the base and the first conductive pattern, and

a second surface, which is a base-side surface, of the soluble layer is bonded to the base and the first conductive pattern with the adhesive layer.

6. The component mount board according to claim 3 , wherein

the second conductive pattern has projecting portions at both ends,

each projecting portion projects outward from the soluble layer in plan view, and

each projecting portion is electrically connected to the first conductive pattern through conductive paste or a conductive adhesive.

7. The component mount board according to claim 6 , wherein

a thickness of the second conductive pattern is twice as great as a thickness of the soluble layer or more.

8. The component mount board according to claim 1 , wherein

the first surface of the soluble layer is a base-side surface of the soluble layer.

9. The component mount board according to claim 8 , wherein

an entirety of the second conductive pattern is formed on the first surface of the soluble layer.

10. The component mount board according to claim 8 , wherein

the first missing portion includes a first extending portion and a second extending portion extending in parallel with each other,

the second conductive pattern includes second conductive patterns each arranged corresponding to the first extending portion and the second extending portion, and

the second conductive pattern corresponding to the first extending portion and the second conductive pattern corresponding to the second extending portion are formed on the first surface of a single soluble layer.

11. The component mount board according to claim 1 , further comprising:

a water-absorption expansion material,

wherein the water-absorption expansion material expands by water absorption and presses the base or the second conductive pattern in a direction perpendicular to a plane of the base to break the second conductive pattern.

12. The component mount board according to claim 11 , further comprising:

a first water-conducting sheet,

wherein the first missing portion includes a first extending portion and a second extending portion extending in parallel with each other,

the first water-conducting sheet is arranged so as to overlap with the base through the water-absorption expansion material, and

in plan view, the first water-conducting sheet and the base are joined to each other at a position outside a region where the first extending portion and the second extending portion are arranged.

13. The component mount board according to claim 12 , further comprising:

a second water-conducting sheet,

wherein the second water-conducting sheet is arranged on an opposite side of the water-absorption expansion material and the board from the first water-conducting sheet, and

in plan view, the second water-conducting sheet and the first water-conducting sheet are joined to each other at a position outside a region where the board is arranged.

14. The component mount board according to claim 11 , further comprising:

a first water-conducting sheet;

a second water-conducting sheet; and

a second missing portion,

wherein the first water-conducting sheet is arranged so as to overlap with the base through the water-absorption expansion material, and the second water-conducting sheet is arranged on an opposite side of the water-absorption expansion material and the board from the first water-conducting sheet, and

in a portion of the base other than a region where the first conductive pattern is formed, the second missing portion is formed so as to penetrate the base and cause a first water-conducting sheet side and a second water-conducting sheet side to communicate with each other.

15. The component mount board according to claim 1 , wherein

the first missing portion linearly extends in plan view.

16. The component mount board according to claim 1 , wherein

the first missing portion extends in a corrugated shape in plan view.

17. The component mount board according to claim 1 , wherein

the base is not soluble in liquid.

18. The component mount board according to claim 1 , wherein

the first conductive pattern is not soluble in liquid.