Component mounting substrate
Provided is a component mount board having a structure capable of more reliably sensing a state of the component mount board being soaked in liquid. A component mount board 100 includes a board 10 having a base 11, a first conductive pattern 30 formed on the base 11, and a mount component 50 electrically connected to the first conductive pattern 30 and a second conductive pattern 40 forming a circuit 60 together with the first conductive pattern 30 in a complementary manner. A portion of the base 11 corresponding to the second conductive pattern 40 is a missing portion 12 where the base 11 is missing. The second conductive pattern 40 is soluble in liquid, or is weakened when becoming wet with liquid.
1 . A component mount board comprising:
a board including a base, a first conductive pattern formed on the base, and a mount component electrically connected to the first conductive pattern; and
a second conductive pattern forming a circuit together with the first conductive pattern in a complementary manner,
wherein a portion of the base corresponding to the second conductive pattern is a missing portion where the base is missing, and
the second conductive pattern is soluble in liquid, or is weakened when becoming wet with liquid.
2 . The component mount board according to claim 1 , wherein
a portion of the second conductive pattern facing the missing portion is a wiring portion forming the circuit.
3 . The component mount board according to claim 1 , wherein
the missing portion is an opening or a cutout-shaped portion formed in the base.
4 . The component mount board according to claim 1 , wherein
the second conductive pattern is arranged over the missing portion, and is bridged between a first portion of the first conductive pattern and a second portion which is a portion of the first conductive pattern apart from the first portion with the missing portion interposed therebetween to electrically connect the first portion and the second portion to each other.
5 . The component mount board according to claim 1 wherein
the liquid contains water,
the second conductive pattern is made of water-soluble conductive paste,
the first conductive pattern is made of metal foil, and
the second conductive pattern is electrically connected to the first conductive pattern through water-insoluble conductive paste interposed between the second conductive pattern and the first conductive pattern.
6 . The component mount board according to claim 1 , wherein
the second conductive pattern contains resin having a hot melt property, and is electrically and mechanically connected to the first conductive pattern by being hot-melt joined to the first conductive pattern.
7 . The component mount board according to claim 1 , wherein
the base is not soluble in the liquid.
8 . The component mount board according to claim 1 , wherein
the first conductive pattern is not soluble in the liquid.
9 . The component mount board according to claim 1 , further comprising:
a second base arranged so as to face the base,
wherein the second conductive pattern is formed on the second base.
10 . The component mount board according to claim 9 , wherein:
a soluble layer, which is an adhesive layer soluble in the liquid, is formed on a surface of the second base facing the base, and
the second conductive pattern is formed on the second base through the soluble layer.
11 . The component mount board according to claim 9 , wherein
the second conductive pattern is directly formed on the second base,
the base and the second base are bonded to each other through an adhesive sheet or a bonding sheet, and
a region of the second base including a region where the second conductive pattern is formed faces the missing portion through a second missing portion formed in the adhesive sheet or the bonding sheet.
12 . The component mount board according to claim 9 , further comprising:
at least one of a first non-woven fabric layer arranged along a surface of the base opposite to a second base side or a second non-woven fabric layer arranged along a surface of the second base opposite to a base side.
13 . The component mount board according to claim 12 , wherein
an adhesive sheet is provided on at least one of a surface of the first non-woven fabric layer opposite to the base side or a surface of the second non-woven fabric layer opposite to the second base side.
14 . The component mount board according to claim 1 , wherein:
a soluble layer soluble in the liquid is formed on a surface of the base opposite to a surface on which the first conductive pattern is formed.
15 . The component mount board according to claim 1 , wherein
a location of an end of the first conductive pattern and a location of an end of the missing portion are coincident with each other.
16 . The component mount board according to claim 1 , wherein
an end of the first conductive pattern close to the missing portion is apart from an end of the missing portion.