IP Library Granted Patent US 11,343,901
Granted Patent B2
US 11,343,901 · App. 17/148,879 · Granted May 24, 2022

Printed-circuit board

Inventors: Kenji Kiya (Tokyo, JP); Tomoki Kanayama (Tokyo, JP)
Assignee: NIPPON MEKTRON, LTD.
H05K1/0201H05K1/0293H05K1/032H05K1/16H05K2201/0129H05K2201/062H05K2201/10181
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Quick Facts
Patent No.
US 11,343,901
App. No.
17/148,879
Granted
May 24, 2022
Kind
B2
Abstract

A printed-circuit board includes: a film-shaped thermoplastic base member having plasticity; a pattern fuse formed from a metal foil layer provided on a principal surface of the base member; a cover member covering at least part of the pattern fuse from an opposite side of the base member; and a first heat-resistant protection film provided on a region overlapping with at least part of the pattern fuse and covering the pattern fuse from a cover member side.

Claims (30)

1. A printed-circuit board comprising:

a film-shaped thermoplastic base member having plasticity;

a pattern fuse formed from a metal foil layer provided on a principal surface of the base member;

a cover member covering at least part of the pattern fuse from an opposite side of the base member;

a first heat-resistant protection film provided on a region overlapping with at least part of the pattern fuse and covering the pattern fuse from a cover member side; and

a second heat-resistant protection film provided on a region overlapping with at least part of the pattern fuse and covering the pattern fuse from a base member side.

2. The printed-circuit board according to claim 1 , wherein

the cover member contains thermoplastic resin.

3. The printed-circuit board according to claim 1 , wherein

the base member contains thermoplastic resin.

4. The printed-circuit board according to claim 1 , wherein

the base member and the second heat-resistant protection film are bonded to each other with a thermoplastic adhesive for the second heat-resistant protection film.

5. The printed-circuit board according to claim 4 , wherein

the adhesive for the second heat-resistant protection film has an opening which opens at a region overlapping with part of the pattern fuse.

6. The printed-circuit board according to claim 1 , wherein

materials of the base member and the cover member are an identical type of material.

7. A printed-circuit board comprising:

a film-shaped thermoplastic base member having plasticity;

a pattern fuse formed from a metal foil layer provided on a principal surface of the base member;

a cover member covering at least part of the pattern fuse from an opposite side of the base member; and

a first heat-resistant protection film provided on a region overlapping with at least part of the pattern fuse and covering the pattern fuse from a cover member side, wherein

the cover member and the first heat-resistant protection film are bonded to each other with a thermoplastic adhesive for the first heat-resistant protection film.

8. The printed-circuit board according to claim 7 , wherein

the adhesive for the first heat-resistant protection film has an opening which opens at a region overlapping with part of the pattern fuse.

9. The printed-circuit board according to claim 7 , wherein

the cover member contains thermoplastic resin.

10. The printed-circuit board according to claim 7 , wherein

the base member contains thermoplastic resin.

11. The printed-circuit board according to claim 7 , wherein

materials of the base member and the cover member are an identical type of material.

Assignments (2)
CHANGE OF NAME Recorded Nov 30, 2024
From: NIPPON MEKTRON, LTD.
To: MEKTEC CORPORATION
Reel/Frame 069464/0771 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 14, 2021
From: KIYA, KENJI; KANAYAMA, TOMOKI
To: NIPPON MEKTRON, LTD.
Reel/Frame 054920/0081 →
Priority Claims (1)
JP JP2020-018038 · Feb 5, 2020 · national
Continuity (1)
Related Publication 20210243879A1 · Aug 5, 2021