Electronic equipment sealing structure and method for manufacturing the same
Provided is an electronic equipment sealing structure that includes a case, a flexible printed circuit board, and an adhesive layer, in which the case includes a case body, an opening provided in the case body, and a pair of thin plate portions having flexibility; part of the flexible printed circuit board is inserted into the case body through the opening; one thin plate portion and the other thin plate portion of the pair of thin plate portions are provided along the opening so as to face each of first and second surfaces of the flexible printed circuit board; and the adhesive layer is provided so as to close a clearance between an inner wall surface of the opening and the flexible printed circuit board.
1 . An electronic equipment sealing structure comprising:
a case;
a flexible printed circuit board; and
an adhesive layer,
wherein the case includes a case body, an opening provided in the case body, and a pair of thin plate portions having flexibility,
part of the flexible printed circuit board is inserted into the case body through the opening,
one thin plate portion and the other thin plate portion of the pair of thin plate portions are provided along the opening so as to face first and second surfaces of the flexible printed circuit board, and
the adhesive layer is provided so as to close a clearance between an inner wall surface of the opening and the flexible printed circuit board.
2 . The electronic equipment sealing structure according to claim 1 , wherein
the flexible printed circuit board includes
a base film,
a line provided on the base film, and
a cover film adhered to the base film so as to cover the line, and
a width of the base film and a width of the cover film are different from each other.
3 . The electronic equipment sealing structure according to claim 2 , wherein
the line and the cover film are provided on each of first and second surface sides of the base film.
4 . The electronic equipment sealing structure according to claim 1 , further comprising:
a supplemental adhesive layer,
wherein the supplemental adhesive layer is provided inside the adhesive layer so as to cover each of the first and second surfaces of the flexible printed circuit board and protrude from each side surface of the flexible printed circuit board in a short-side direction of the flexible printed circuit board.
5 . A method for manufacturing an electronic equipment sealing structure, comprising:
providing an opening in a case;
providing a pair of thin plate portions having flexibility along the opening such that one thin plate portion and the other thin plate portion of the pair of thin plate portions face each of first and second surfaces of a flexible printed circuit board to be inserted into the case through the opening;
providing an adhesive layer on each of inner surfaces of the one thin plate portion and the other thin plate portion;
inserting part of the flexible printed circuit board into the case through the opening; and
performing adhering with the adhesive layer.
6 . The method for manufacturing the electronic equipment sealing structure according to claim 5 , wherein
the flexible printed circuit board includes
a base film,
a line provided on the base film, and
a cover film adhered to the base film so as to cover the line, and
a width of the base film and a width of the cover film are different from each other.
7 . The method for manufacturing the electronic equipment sealing structure according to claim 6 , wherein
the line and the cover film are provided on each of first and second surface sides of the base film.
8 . The method for manufacturing the electronic equipment sealing structure according to claim 5 , further comprising:
before the inserting the part of the flexible printed circuit board into the case through the opening, providing a supplemental adhesive layer such that the supplemental adhesive layer covers the first and second surfaces of the flexible printed circuit board and protrudes from each side surface of the flexible printed circuit board in a short-side direction of the flexible printed circuit board.