IP Library Granted Patent US 12,546,667
Granted Patent B2
US 12,546,667 · App. 18/192,901 · Granted Feb 10, 2026

Temperature measurement device

Inventors: Shunsuke Tomita (Tokyo, JP); Kenichi Nakayama (Tokyo, JP); Tomoki Kanayama (Tokyo, JP)
Assignee: MEKTEC CORPORATION
G01K7/22G01K1/08G01R31/374G01R31/3835
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Quick Facts
Patent No.
US 12,546,667
App. No.
18/192,901
Granted
Feb 10, 2026
Kind
B2
Abstract

Provided is a temperature measurement device which includes: a case; a flexible printed circuit board; and a thermistor element mounting portion, the case integrally has a first case portion, a second case portion, and a holding portion; the flexible printed circuit board has a trunk and a branch divided from the trunk; the trunk is fixed to a first surface of the first case portion; the thermistor element mounting portion is arranged in the branch and is fixed to a first surface of the second case portion; the second case portion is folded such that a second surface of the first case portion and a second surface of the second case portion are in contact with each other; and the holding portion holds a part of the branch between a portion divided from the trunk and a portion where the thermistor element mounting portion is arranged.

Claims (18)

1 . A temperature measurement device comprising:

a case that is fixed to an article to be measured;

a flexible printed circuit board that is attached to the case; and

a thermistor element mounting portion, wherein:

the case integrally has a first case portion, a second case portion, and a holding portion;

the flexible printed circuit board has a trunk and a branch divided from the trunk;

the trunk is fixed to a first surface of the first case portion;

the thermistor element mounting portion is arranged in the branch and is fixed to a first surface of the second case portion;

the second case portion is folded such that a second surface of the first case portion and a second surface of the second case portion are in contact with each other; and

the holding portion holds a part of the branch between a portion divided from the trunk and a portion where the thermistor element mounting portion is arranged so as to restrain movement of the branch.

2 . The temperature measurement device according to claim 1 , wherein:

the holding portion includes a cover portion; and

the cover portion is connected to the second case portion by a hinge, and the cover portion is folded back by bending the hinge such that the part of the branch is stored in the cover portion.

3 . The temperature measurement device according to claim 1 , wherein:

the holding portion has a pair of hooked holding portions; and

the pair of hooked holding portions is provided on both sides of the branch in a transverse direction so as to allow movement of the branch in a direction closer to the surface of the second case portion and to restrict movement of the branch in a direction away from the surface of the second case portion.

4 . The temperature measurement device according to claim 1 , wherein

the flexible printed circuit board has not only a wire connected to a thermistor element but also a wire for measuring a voltage of the article to be measured.

Assignments (2)
CHANGE OF NAME Recorded Nov 30, 2024
From: NIPPON MEKTRON, LTD.
To: MEKTEC CORPORATION
Reel/Frame 069464/0771 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2023
From: TOMITA, SHUNSUKE; NAKAYAMA, KENICHI; KANAYAMA, TOMOKI
To: NIPPON MEKTRON, LTD.
Reel/Frame 063167/0244 →
Priority Claims (1)
JP 2022-090206 · Jun 2, 2022 · national
Continuity (1)
Related Publication 20230392994A1 · Dec 7, 2023
References Cited (6)
US 11473979B2 · Takase · 2022 [cited by examiner]
US 11747215B2 · Watanabe · 2023 [cited by examiner]
US 20130083326A1 · Clark · 2013 [cited by examiner]
US 20200333192A1 · Takase et al. · 2020 [cited by applicant]
US 20220404214A1 · Tomita · 2022 [cited by examiner]
JP 2019074327A · 2019 [cited by applicant]