IP Library Granted Patent US 11,754,632
Granted Patent B2
US 11,754,632 · App. 17/544,903 · Granted Sep 12, 2023

Voltage monitoring module

Inventors: Hajime Gyotoku (Tokyo, JP); Kazuki Ikemiya (Tokyo, JP); Shuzo Yamada (Tokyo, JP)
Assignee: NIPPON MEKTRON, LTD.
G01R31/3835H05K1/0277H05K2201/1034H05K2201/10272
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Quick Facts
Patent No.
US 11,754,632
App. No.
17/544,903
Granted
Sep 12, 2023
Kind
B2
Abstract

Provided is a voltage monitoring module which includes: a land; and a metal plate arranged on the land and soldered to the land, in which a through-hole is partially formed at a location of the metal plate corresponding to the land, a non-formation area is formed at a location of the land corresponding to part of the through-hole, and no conductor is formed in the non-formation area.

Claims (24)

1. A voltage monitoring module comprising:

a land; and

a metal plate arranged on the land and soldered to the land,

wherein

the land is formed at an end portion of a wiring,

a through-hole is partially formed at a location of the metal plate corresponding to the land,

a non-formation area is formed at a location of the land corresponding to part of the through-hole, and

no conductor is formed in at least a part of the non-formation area when viewed in a thickness direction of the metal plate.

2. The voltage monitoring module according to claim 1 , wherein

when viewed in the thickness direction of the metal plate, the land is within an outline of the metal plate.

3. The voltage monitoring module according to claim 1 , wherein

when viewed in the thickness direction of the metal plate, part of the land protrudes from an outline of the metal plate.

4. The voltage monitoring module according to claim 1 , wherein

when viewed in the thickness direction of the metal plate, the non-formation area is within the through-hole.

5. The voltage monitoring module according to claim 1 , wherein

when viewed in the thickness direction of the metal plate, part of the non- formation area protrudes from the through-hole.

6. The voltage monitoring module according to claim 1 , wherein

at least one of the through-hole or the non-formation area is in a non-circular shape.

7. The voltage monitoring module according to claim 1 , wherein

the through-hole includes multiple through-holes formed at the metal plate, and the non-formation area includes multiple non-formation areas present on the land.

8. The voltage monitoring module according to claim 1 , wherein

the metal plate is a bus bar connecting multiple battery cells in series.

9. The voltage monitoring module according to claim 1 , wherein

the metal plate is a metal tab connected to a bus bar.

Assignments (2)
CHANGE OF NAME Recorded Nov 30, 2024
From: NIPPON MEKTRON, LTD.
To: MEKTEC CORPORATION
Reel/Frame 069464/0771 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 7, 2021
From: GYOTOKU, HAJIME; IKEMIYA, KAZUKI; YAMADA, SHUZO
To: NIPPON MEKTRON, LTD.
Reel/Frame 058329/0483 →
Priority Claims (1)
JP 2021-010869 · Jan 27, 2021 · national
Continuity (1)
Related Publication 20220236332A1 · Jul 28, 2022