IP Library Granted Patent US 12,144,068
Granted Patent B2
US 12,144,068 · App. 17/182,351 · Granted Nov 12, 2024

Heater having flexible printed wiring board and method for manufacturing same

Inventors: Garo Miyamoto (Tokyo, JP); Shunsuke Aoyama (Tokyo, JP)
Assignee: NIPPON MEKTRON, LTD.
H05B3/34H05K1/0212H05K1/189H05B2203/013H05B2203/017H05K2201/0355
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Quick Facts
Patent No.
US 12,144,068
App. No.
17/182,351
Granted
Nov 12, 2024
Kind
B2
Abstract

Provided is a heater which includes a flexible printed wiring board, in which the flexible printed wiring board includes a base film, a first metal foil, and a second metal foil, the first metal foil forms a heater circuit portion that generates heat when energized, on a first surface of the base film, and the second metal foil forms a heat conductive foil portion that maintains a non-energized state, on a second surface of the base film.

Claims (9)

1. A method for manufacturing a heater having a flexible printed wiring board, comprising an etching step and a laminating step in this order, wherein

the etching step comprises: etching a first metal foil positioned on a first surface of a base film and a second metal foil positioned on a second surface of the base film; forming a heater circuit portion that generates heat when energized, by a part of the first metal foil; and forming a heat conductive foil portion that maintains a non-energized state, by a part of the second metal foil, wherein the heater circuit portion and the heat conductive foil portion are formed at the same time, and

the laminating step comprises providing a first cover film that covers a surface of the first metal foil and a second cover film that covers a surface of the second metal foil.

2. The method for manufacturing the heater having the flexible printed wiring board according to claim 1 , wherein the heat conductive foil portion covers a region of the second surface corresponding to an entire region of the first surface in which the heater circuit portion is provided, the base film being interposed between the heat conductive foil portion and the heater circuit portion.

3. The method for manufacturing the heater having the flexible printed wiring board according to claim 1 , wherein a part of the first metal foil forms an energizing portion that energizes the heater circuit portion in the etching step.

4. The method for manufacturing the heater having the flexible printed wiring board according to claim 3 , further comprising a reflow step following the laminating step, wherein

the reflow step comprises providing at least one electronic component that is disposed on a surface of the first cover film and is electrically connected to the first metal foil, and a connector that is electrically connected to the energizing portion, by reflow soldering.

5. The method for manufacturing the heater having the flexible printed wiring board according to claim 3 , wherein

the energizing portion, the heater circuit portion, and the heat conductive foil portion are formed at the same time.

Assignments (2)
CHANGE OF NAME Recorded Nov 30, 2024
From: NIPPON MEKTRON, LTD.
To: MEKTEC CORPORATION
Reel/Frame 069464/0771 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 23, 2021
From: MIYAMOTO, GARO; AOYAMA, SHUNSUKE
To: NIPPON MEKTRON, LTD.
Reel/Frame 055364/0114 →
Priority Claims (1)
JP 2020-056364 · Mar 26, 2020 · national
Continuity (1)
Related Publication 20210307118A1 · Sep 30, 2021