IP Library Granted Patent US 12,713,529
Granted Patent B2
US 12,713,529 · App. 18/569,583 · Granted Aug 18, 2026

Component mounting board

Inventor: Azumi Tominaga (Tokyo, JP)
Assignee: MEKTEC CORPORATION
H05K1/056H05K1/0298H05K3/1208
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Quick Facts
Patent No.
US 12,713,529
App. No.
18/569,583
Granted
Aug 18, 2026
Kind
B2
Abstract

Provided is a component mount board having such a structure that a state of a component mount board being soaked in liquid can be more reliably sensed. A component mount board 100 includes a sheet-shaped moisture detection sensor 90 . The moisture detection sensor 90 includes: a board 10 having a base 11 , a first conductive pattern 30 formed on the base 11 , and a mount component 50 electrically connected to the first conductive pattern 30 ; and a second conductive pattern 40 forming a circuit 60 together with the first conductive pattern 30 in a complementary manner. A portion of the base 11 corresponding to the second conductive pattern 40 is a missing portion 12 . The component mount board 100 further includes a water-absorption expansion material 70 . When expanding by water absorption, the water-absorption expansion material 70 presses the base 11 or the second conductive pattern 40 in a direction perpendicular to the plane of the base 11 to break the second conductive pattern 40.

Claims (22)

1 . A component mount board comprising:

a sheet-shaped moisture detection sensor,

wherein the moisture detection sensor includes: a board having a base, a first conductive pattern formed on the base, and a mount component electrically connected to the first conductive pattern; and

a second conductive pattern forming a circuit together with the first conductive pattern in a complementary manner,

a portion of the base corresponding to the second conductive pattern is a missing portion,

the component mount board further includes a water-absorption expansion material, and

when expanding by water absorption, the water-absorption expansion material presses the base or the second conductive pattern in a direction perpendicular to a plane of the base to break the second conductive pattern.

2 . The component mount board according to claim 1 , wherein

the water-absorption expansion material presses part of the base to displace two portions of the base sandwiching the missing portion relative to each other.

3 . The component mount board according to claim 2 , wherein

the missing portion includes a first extending portion and a second extending portion extending in parallel with each other along a planar direction of the base, and

the water-absorption expansion material is arranged at a location corresponding to a portion of the base between the first extending portion and the second extending portion, and presses the portion of the base.

4 . The component mount board according to claim 3 , wherein

the missing portion includes a third extending portion extending from an intermediate portion of the first extending portion in a direction of extension thereof to an intermediate portion of the second extending portion in a direction of extension thereof.

5 . The component mount board according to claim 1 , wherein

the water-absorption expansion material is arranged at a location corresponding to the second conductive pattern, and presses the second conductive pattern in the missing portion.

6 . The component mount board according to claim 1 , wherein

an expansion of the water-absorption expansion material in a first direction is greater than an expansion in a second direction perpendicular to the first direction, and the water-absorption expansion material is arranged such that the first direction is coincident with the direction perpendicular to the plane of the base.

7 . The component mount board according to claim 6 , wherein

the water-absorption expansion material is formed in a sheet shape, and the first direction is a thickness direction of the water-absorption expansion material.

8 . The component mount board according to claim 1 , further comprising:

a water-conducting sheet arranged on an opposite side of the water-absorption expansion material from the moisture detection sensor.

Assignments (2)
CHANGE OF NAME Recorded Nov 30, 2024
From: NIPPON MEKTRON, LTD.
To: MEKTEC CORPORATION
Reel/Frame 069464/0771 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2023
From: TOMINAGA, AZUMI
To: NIPPON MEKTRON, LTD.
Reel/Frame 065849/0840 →
Priority Claims (1)
JP 2022-027579 · Feb 25, 2022 · national
Continuity (1)
Related Publication 20240292532A1 · Aug 29, 2024
References Cited (8)
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JP 2021197465A · 2021 [cited by applicant]
International Search Report issued in PCT/JP2022/037293; mailed Nov. 8, 2022. [cited by applicant]