IP Library Granted Patent US 12,601,639
Granted Patent B2
US 12,601,639 · App. 18/364,054 · Granted Apr 14, 2026

Temperature measurement device for attachement to a housing, for example, a battery case

Inventors: Katsuhito Shirota (Tokyo, JP); Yuki Komuro (Tokyo, JP); Tomoki Kanayama (Tokyo, JP)
Assignee: MEKTEC CORPORATION
G01K7/22G01K1/08G01K1/14H01M10/486
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Quick Facts
Patent No.
US 12,601,639
App. No.
18/364,054
Granted
Apr 14, 2026
Kind
B2
Abstract

Provided is a temperature measurement device including: a case; a flexible printed circuit board attached to the case; a pressing plate; and an elastic body, in which: the flexible printed circuit board includes a thermistor element region; the elastic body is interposed between the thermistor element region and the pressing plate; the pressing plate is configured to press the thermistor element region through the elastic body; the case has a through-hole; as viewed in a direction of pressing the thermistor element region by the pressing plate, the thermistor element region and the elastic body are positioned within an area where the through-hole is provided; and the thermistor element region is configured to protrude, through the through-hole, from an attachment surface side of the case attached to the flexible printed circuit board toward a surface side of the case opposite to the attachment surface side.

Claims (27)

1 . A temperature measurement device comprising:

a case;

a flexible printed circuit board attached to the case;

a pressing plate; and

an elastic body,

wherein the flexible printed circuit board includes a thermistor element region,

the elastic body is interposed between the thermistor element region and the pressing plate,

the pressing plate is configured to press the thermistor element region through the elastic body,

the case has a through-hole,

as viewed in a direction of pressing the thermistor element region by the pressing plate, the thermistor element region and the elastic body are positioned within an area where the through-hole is provided, and

the thermistor element region is configured to protrude, through the through-hole, from an attachment surface side of the case attached to the flexible printed circuit board toward a surface side of the case opposite to the attachment surface side.

2 . The temperature measurement device according to claim 1 , wherein

the flexible printed circuit board has a first positioning hole and a second positioning hole,

the first positioning hole and the second positioning hole are each provided on one side and another side of the thermistor element region,

the case or the pressing plate has protrusions each corresponding to the first positioning hole and the second positioning hole,

the protrusions are each inserted into the first positioning hole and the second positioning hole, by which the flexible printed circuit board is positioned on the case or the pressing plate, and

one of the first positioning hole or the second positioning hole is a long hole.

3 . The temperature measurement device according to claim 1 , further comprising:

a holding member,

wherein the holding member has a stopper, and is configured to hold the thermistor element region, and

the stopper is configured to reduce dropping of the holding member to the surface side of the case opposite to the attachment surface side through the through-hole.

4 . The temperature measurement device according to claim 1 , wherein

the flexible printed circuit board further has, in addition to a line connected to a thermistor element, a line for measuring a voltage of a measurement target.

5 . The temperature measurement device according to claim 1 , wherein

the elastic body is configured to press the thermistor element region to protrude through the through-hole.

6 . The temperature measurement device according to claim 1 , wherein

the pressing plate presses the thermistor element region from outside the case.

Assignments (2)
CHANGE OF NAME Recorded Nov 30, 2024
From: NIPPON MEKTRON, LTD.
To: MEKTEC CORPORATION
Reel/Frame 069464/0771 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2023
From: SHIROTA, KATSUHITO; KOMURO, YUKI; KANAYAMA, TOMOKI
To: NIPPON MEKTRON, LTD.
Reel/Frame 064469/0156 →
Priority Claims (1)
JP 2022-134400 · Aug 25, 2022 · national
Continuity (1)
Related Publication 20240068885A1 · Feb 29, 2024
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