Sensor unit
A sensor unit disclosed herein is a sensor unit that is to be mounted in a housing section included in a device, and the sensor unit includes a FPC including a detection line and having flexibility, a temperature sensor connected to a connection portion of the detection line on a surface of the FPC, and an elastic member disposed on the surface of the FPC so as to be elastically deformable. The elastic member is to be elastically compressed within the housing section to press a first plate member mounted on a back surface of the FPC toward the device by a resilient force.
1. A sensor unit to be mounted in a housing section included in a detection object, the sensor unit comprising:
a conductive path structure including a conductive path and having flexibility and a band-like shape;
a sensor element connected to the conductive path on a surface of the conductive path structure; and
an elastic structure disposed on the surface of the conductive path structure so as to be elastically deformable, the elastic structure is configured to be elastically compressed within the housing section to press a back surface side portion of the conductive path structure in a pressing direction toward the detection object by a resilient force, wherein
the sensor element and the elastic structure both protrude from the surface of the conductive path structure in a direction that is opposite to the pressing direction.
2. The sensor unit according to claim 1 , wherein the elastic structure that is elastically compressed is configured to be inserted into the housing section together with the conductive path structure that is connected to the sensor element and is mounted on the detection object.
3. The sensor unit according to claim 2 , wherein
the sensor element is a temperature sensor to detect a temperature of the detection object, and
a plate is mounted on a back surface of the conductive path structure.
4. The sensor unit according to claim 3 , wherein the plate is a metal plate having thermal conductivity.
5. The sensor unit according to claim 2 , wherein the elastic structure is disposed adjacent and around the sensor element and on the conductive path structure.
6. The sensor unit according to claim 5 , wherein a mold section made of resin and that covers the sensor element is disposed between the elastic structure and the sensor element.
7. The sensor unit according to claim 5 , wherein a cover that covers an entirety of the elastic structure and the sensor element is disposed on a portion of the elastic structure on an opposite side from the conductive path structure.
8. The sensor unit according to claim 7 , wherein the cover includes a body section that is closely contacted with the conductive path structure and a guide section that extends from a front edge of the body section with respect to an insertion direction into the housing section toward the conductive path structure while being inclined.
9. The sensor unit according to claim 5 , wherein
the conductive path structure includes a bendable structure that extends from a position where the elastic structure is disposed so as to be bent, and
a second elastic structure is disposed on the surface of the conductive path structure via the bendable structure, and the second elastic structure is to be disposed on top of the elastic structure.
10. The sensor unit according to claim 9 , wherein a protection plate is mounted on a back surface of a portion of the conductive path structure on which the second elastic structure is disposed.
11. The sensor unit according to claim 1 , wherein the sensor element is covered with the elastic structure.
12. A sensor unit to be mounted in a housing section included in a detection object, the sensor unit comprising:
a conductive path structure including a conductive path and having flexibility and a band-like shape;
a sensor element connected to the conductive path on a surface of the conductive path structure; and
an elastic structure disposed on the surface of the conductive path structure so as to be elastically deformable, the elastic structure is configured to be elastically compressed within the housing section to press a back surface side portion of the conductive path structure toward the detection object by a resilient force, wherein
the elastic structure that is elastically compressed is configured to be inserted into the housing section together with the conductive path structure that is connected to the sensor element and is mounted on the detection object,
the elastic structure is disposed adjacent and around the sensor element and on the conductive path structure,
a cover that covers an entirety of the elastic structure and the sensor element is disposed on a portion of the elastic structure on an opposite side from the conductive path structure, and
the cover includes a body section that is closely contacted with the conductive path structure and a guide section that extends from a front edge of the body section with respect to an insertion direction into the housing section toward the conductive path structure while being inclined.