Patent Assignment
Reel/Frame 053780/0568
Assignment of Assignor's Interest
Recorded: 2020-09-16
Pages: 7
Assignors
MUNEKAWA, YURIKA
Executed: 2020-09-10
NAKANO, TAKESHI
Executed: 2020-09-10
ARAI, MASAYA
Executed: 2020-09-10
SHIMAZAKI, TAKANORI
Executed: 2020-09-10
KATSUYAMA, TSUKASA
Executed: 2020-09-10
Assignee
TAMURA CORPORATION
1-19-43, HIGASHI-OIZUMI, NERIMA-KU, TOKYO, 178-8511, JAPAN
Covered Property
(1)
Lead-Free Solder Alloy, Solder Joining Material, Electronic Circuit Mounting Substrate, and Electronic Control Device