Lead-free solder alloy, solder joining material, electronic circuit mounting substrate, and electronic control device
A lead-free solder alloy includes 2.0% by mass or more and 4.0% by mass or less of Ag, 0.3% by mass or more and 0.7% by mass or less of Cu, 1.2% by mass or more and 2.0% by mass or less of Bi, 0.5% by mass or more and 2.1% by mass or less of In, 3.0% by mass or more and 4.0% by mass or less of Sb, 0.001% by mass or more and 0.05% by mass or less of Ni, 0.001% by mass or more and 0.01% by mass or less of Co, and the balance being Sn.
1. A lead-free solder alloy for an on-vehicle electronic circuit mounting substrate comprising:
2.0% by mass or more and 4.0% by mass or less of Ag;
0.3% by mass or more and 0.7% by mass or less of Cu;
1.7% by mass or more and 2.0% by mass or less of Bi;
0.5% by mass or more and 2.1% by mass or less of In;
3.0% by mass or more and 4.0% by mass or less of Sb;
0.001% by mass or more and 0.05% by mass or less of Ni;
0.001% by mass or more and 0.01% by mass or less of Co;
optionally further comprising at least one of P, Ga, and Ge in a total amount of 0.001% by mass or more and 0.05% by mass or less;
optionally further comprising at least one of Fe, Mn, Cr, and Mo in a total amount of 0.001% by mass or more and 0.05% by mass or less; and
the balance being Sn.
2. The lead-free solder alloy according to claim 1 , wherein an amount of Cu is 0.5% by mass or more and 0.7% or less.
3. The lead-free solder alloy according to claim 1 , wherein an amount of In is 0.75% by mass or more and 2.1% by mass or less.
4. The lead-free solder alloy according to claim 2 , wherein an amount of In is 0.75% by mass or more and 2.1% by mass or less.
5. The lead-free solder alloy according to claim 1 , wherein an amount of Sb is 3.0% by mass or more and 3.8% by mass or less.
6. The lead-free solder alloy according to claim 3 , wherein an amount of Sb is 3.0% by mass or more and 3.8% by mass or less.
7. A lead-free solder alloy comprising:
2.0% by mass or more and 4.0% by mass or less of Ag;
0.3% by mass or more and 0.5% by mass or less of Cu;
1.2% by mass or more and 2.0% by mass or less of Bi;
0.5% by mass or more and 2.1% by mass or less of In;
3.0% by mass or more and 4.0% by mass or less of Sb;
0.001% by mass or more and 0.05% by mass or less of Ni;
0.001% by mass or more and 0.01% by mass or less of Co;
optionally further comprising at least one of P, Ga, and Ge in a total amount of 0.001% by mass or more and 0.05% by mass or less;
optionally further comprising at least one of Fe, Mn, Cr, and Mo in a total amount of 0.001% by mass or more and 0.05% by mass or less; and
the balance being Sn.