IP Library › Assignment 053785/0492
Patent Assignment
Reel/Frame 053785/0492

Assignment of Assignor's Interest

Recorded: 2020-09-16 Pages: 9
Assignors
CHUAH, TIN POAY
Executed: 2020-07-09
CHEAH, BOK ENG
Executed: 2020-07-09
KONG, JACKSON CHUNG PENG
Executed: 2020-07-09
Assignee
INTEL IP CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Three Dimensional Foldable Substrate with Vertical Side Interface
Application: 16/887,902 →
Publication: US 2021/0051801
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the the Assignee's Name Previously Recorded at Reel: 053785 Frame: 0492. Assignor(S) Hereby Confirms the Assignment. May 24, 2022
From: CHUAH, TIN POAY; CHEAH, BOK ENG; KONG, JACKSON CHUNG PENG
To: INTEL CORPORATION
Reel/Frame 060168/0887 →