Three dimensional foldable substrate with vertical side interface
An electronic device and associated methods are disclosed. In one example, the electronic device includes a first rigid substrate, a second rigid substrate, a flexible substrate comprising a first portion attached to the first rigid substrate, a second portion attached to the second rigid substrate, a middle portion connecting the first portion to the second portion, wherein the middle portion is bent, and metallic traces therethrough, and a component forming a direct interface with the middle portion of the flexible substrate, the component electrically coupled to the metallic traces. In selected examples, the device further includes a casing.
1. An electronic assembly comprising:
a first rigid substrate;
a second rigid substrate;
a flexible substrate comprising:
a first portion attached to the first rigid substrate;
a second portion attached to the second rigid substrate;
a middle portion connecting the first portion to the second portion, wherein the middle portion is bent; and
conductive traces therethrough;
a side component on an external surface of a bend in the middle portion of the flexible substrate, the component forming a direct interface with the middle portion of the flexible substrate, the component electrically coupled to the conductive traces; and
at least one component mounted on the first rigid substrate or the second rigid substrate, the at least one component electrically coupled to the side component.
2. The assembly of claim 1 , wherein the flexible substrate comprises a plurality of metallic layers alternating with a plurality of dielectric layers.
3. The assembly of claim 1 , wherein the side component is a connector, a connector receptacle, an indicator, a switch, a display, a transmitter, or a receiver.
4. The assembly of claim 1 , wherein the middle portion of the flexible substrate comprises a first segment and a second segment separated by a gap.
5. The assembly of claim 4 , further comprising a third rigid substrate partially covering the first segment of the middle portion.
6. The assembly of claim 5 , wherein the side component is disposed on the second segment of the middle portion, and wherein a second side component is disposed on the third rigid substrate.
7. The assembly of claim 6 , wherein the second side component disposed on the third rigid substrate has a first thickness, the side component disposed on the second segment has a second thickness, and wherein the first thickness is less than the second thickness.
8. The assembly of claim 5 , wherein the side component is directly connected to a portion of the flexible substrate not covered by the third rigid substrate.
9. The assembly of claim 5 , wherein the third rigid substrate comprises a printed circuit board, organic packaging, silicon-based substrates, or interposers.
10. The assembly of claim 1 , further comprising a retention bar mounted to the first or second rigid substrate, wherein the retention bar secures the side component forming a direct interface on the middle portion of the flexible substrate.
11. The assembly of claim 1 , wherein the middle portion of the flexible substrate includes a portion that is orthogonal to the first and second portions of the flexible substrate.
12. The assembly of claim 1 , wherein the middle portion of the flexible substrate comprises a corner between the first rigid substrate and the second rigid substrate.
13. The assembly of claim 1 , wherein the first portion of the flexible substrate is sandwiched by two sub-components of the first rigid substrate, and the second portion of the flexible substrate is sandwiched by two sub-components of the second rigid substrate.
14. The assembly of claim 1 , further comprising an internal printed circuit board parallel to and adjacent to the first rigid substrate and the second rigid substrate.
15. The assembly of claim 14 , further comprising:
an external printed circuit board forming a direct interface with the internal printed circuit board; and
one or more components forming a direct interface with the external printed circuit board on an external surface of the external printed circuit board.
16. A device comprising:
an assembly comprising:
a first rigid substrate;
a second rigid substrate;
a flexible substrate comprising:
a first portion attached to the first rigid substrate;
a second portion attached to the second rigid substrate; and
a middle portion connecting the first portion to the second portion, wherein the middle portion is bent;
a side component forming a direct interface with the middle portion of the flexible substrate, the side component mounted on an external surface of the middle portion;
a casing surrounding the assembly; and
a touch screen attached to the casing.
17. The device of claim 16 , wherein the side component extends at least partially through the casing.
18. A method of making an assembly comprising:
removing a portion of a printed circuit board to expose a central portion of flexible substrate;
mounting one or more components on the printed circuit board and an external surface of the central portion of the flexible substrate; and
folding the printed circuit board along the central portion of the flexible substrate, wherein at least one of the one or more components is mounted on a folded section of the central portion.
19. The method of claim 18 , wherein folding comprises aligning first and second sides of the printed circuit board.
20. The method of claim 18 , further comprising enclosing the assembly in a housing, wherein the one or more components on the central portion of the flexible substrate extends at least partially through the housing.