Patent Assignment
Reel/Frame 053880/0367
Assignment of Assignor's Interest
Recorded: 2020-09-25
Pages: 6
Assignors
JEON, HYUNGJUN
Executed: 2020-07-28
KIM, TAEYEONG
Executed: 2020-07-28
KIM, HOECHUL
Executed: 2020-07-28
MIN, JUNHONG
Executed: 2020-07-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Bonding Apparatus