Patent Assignment
Reel/Frame 053891/0639
Assignment of Assignor's Interest
Recorded: 2020-09-25
Pages: 4
Assignors
ESSIG, KAY STEFAN
Executed: 2020-07-16
YANNOU, JEAN MARC
Executed: 2020-09-21
FACTOR, BRADFORD
Executed: 2020-09-22
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Method for Manufacturing the Same