Patent Assignment
Reel/Frame 053905/0576
Assignment of Assignor's Interest
Recorded: 2020-09-28
Pages: 8
Assignors
YOSHIDA, TETSUYA
Executed: 2020-09-27
HOSOYA, TAKUMI
Executed: 2020-09-28
SHIMOYOSHI, HIDETO
Executed: 2020-09-28
YAMAZAKI, KAZUHIRO
Executed: 2020-09-28
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Wide Bandgap Wafer Backside Capped by a Detection Facilitating Layer
Application:
16/948,665 →
Publication:
US 2021/0407799
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 25, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 054523/0378 →
Release of Security Interest in Patents Previously Recorded at Reel 054523, Frame 0378
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0602 →