Patent Assignment
Reel/Frame 053913/0947
Assignment of Assignor's Interest
Recorded: 2020-09-29
Pages: 3
Assignors
LI, LINPING
Executed: 2020-09-11
SHENG, JINGHAO
Executed: 2020-09-11
JIANG, ZHOU
Executed: 2020-09-11
Assignee
HANGZHOU JWL TECHNOLOGY INC.
ROOM 1004, FLOOR 10, BUILDING 4, NO.9, JIUHUAN ROAD, JIANGGAN DISTRICT, HANGZHOU, ZHEJIANG, 330000, CHINA
Covered Property
(1)
Chip Packaging Method and Chip Packaging Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.