Patent Assignment
Reel/Frame 055115/0735
Change of Name
Recorded: 2021-01-26
Pages: 4
Assignor
HANGZHOU JWL TECHNOLOGY INC.
Executed: 2020-09-28
Assignee
JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD.
ROOM 1219-23, BUILDING 3, NO. 1366, HONGFENG ROAD, KANGSHAN SUBDISTRICT, HUZHOU CITY, ZHEJIANG PROVINCE, 313000, CHINA
Covered Property
(1)
Chip Packaging Method and Chip Packaging Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.