Patent Assignment
Reel/Frame 053920/0883
Assignment of Assignor's Interest
Recorded: 2020-09-29
Pages: 6
Assignors
HIRAYAMA, YUYA
Executed: 2020-08-24
KUSHIDA, KEISUKE
Executed: 2020-08-24
TOMIOKA, KENICHI
Executed: 2020-08-24
SHIMIZU, HIROSHI
Executed: 2020-08-24
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Thermosetting Resin Composition, Prepreg, Resin-Coated Metal Foil, Laminate, Printed Wiring Board, and Semiconductor Package
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →