Patent Assignment
Reel/Frame 053969/0504
Assignment of Assignor's Interest
Recorded: 2020-10-05
Pages: 9
Assignors
OHORI, TAKAHIRO
Executed: 2020-08-25
MIURA, TAIKI
Executed: 2020-08-20
OGASAWARA, MASAHIRO
Executed: 2020-08-20
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU,, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Etching Method and Substrate Processing Apparatus