Etching method and substrate processing apparatus
There is provision of an etching method including a step of preparing a substrate over which a boron film or a boron-containing film is formed, a step of supplying a process gas containing chlorine gas, fluorine-containing gas, and hydrogen-containing gas, and a step of etching the boron film or the boron-containing film via a mask using a plasma formed from the process gas.
1. A method comprising:
preparing a substrate over which a boron film or a boron-doped silicon film is formed;
supplying a process gas consisting of chlorine gas, fluorine-containing gas, hydrogen-containing gas, silicon-containing gas, and oxygen-containing gas; and
etching the boron film or the boron-doped silicon film via a mask using a plasma formed from the process gas.
2. The method according to claim 1 , wherein the mask is a silicon-containing film.
3. The method according to claim 1 , wherein the plasma is formed by applying pulsating radio frequency power for drawing ions and pulsating radio frequency power for generating the plasma in sequence.
4. The method according to claim 1 , the fluorine-containing gas is nitrogen trifluoride (NF 3 ) or carbon tetrafluoride (CF 4 ) gas.
5. The method according to claim 1 , the hydrogen-containing gas is hydrogen (H 2 ) or hydrogen bromide (HBr) gas.
6. The method according to claim 1 , the silicon-containing gas is silicon tetrachloride (SiCl 4 ) or silicon tetrafluoride (SiF 4 ) gas.
7. The method according to claim 1 , the oxygen-containing gas is oxygen (O 2 ), carbon dioxide (CO 2 ), or carbonyl sulfide (COS) gas.
8. The method according to claim 1 , the process gas contains chlorine (Cl 2 ), nitrogen trifluoride (NF 3 ), hydrogen (H 2 ), silicon tetrachloride (SiCl 4 ), and oxygen (O 2 ) gas.
9. A substrate processing apparatus comprising:
a chamber;
a gas supply section; and
a controller configured to perform a method including
preparing a substrate, over which a boron film or boron-doped silicon film is formed, in the chamber;
supplying a process gas consisting of chlorine gas, fluorine-containing gas, hydrogen-containing gas, silicon-containing gas, and oxygen-containing gas, into the chamber; and
etching the boron film or the boron-doped silicon film via a mask by a plasma formed from the process gas.