IP Library › Assignment 054027/0376
Patent Assignment
Reel/Frame 054027/0376

Assignment of Assignor's Interest

Recorded: 2020-10-12 Pages: 5
Assignors
SEDDON, MICHAEL J.
Executed: 2019-01-22
NOMA, TAKASHI
Executed: 2019-01-24
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Methods of Aligning a Semiconductor Wafer for Singulation
Application: 17/068,129 →
Publication: US 2021/0028064
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Feb 17, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 055315/0350 →
Release of Security Interest in Patents Previously Recorded at Reel 055315, Frame 0350 Aug 17, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064618/0881 →