IP Library › Assignment 055315/0350
Patent Assignment
Reel/Frame 055315/0350

SECURITY INTEREST

Recorded: 2021-02-17 Received: 2021-02-17 Pages: 19
Assignors
Assignee
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
60 WALL STREET, NEW YORK, NY, 10005, UNITED STATES
Covered Applications (100)
SEMICONDUCTOR DEVICE
App. No. 17/139,748
→
HIGH DYNAMIC RANGE IMAGE SENSORS
App. No. 17/137,860
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SEMICONDUCTOR DESIGN OPTIMIZATION USING AT LEAST ONE NEURAL NETWORK
App. No. 17/137,773
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METHOD OF REDUCING RESIDUAL CONTAMINATION IN SINGULATED SEMICONDUCTOR DIE
App. No. 17/136,319
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SEMICONDUCTOR SUBSTRATE SINGULATION SYSTEMS AND RELATED METHODS
App. No. 17/136,243
→
SPACER WITH PATTERN LAYOUT FOR DUAL SIDE COOLING POWER MODULE
App. No. 17/136,286
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LIDAR SYSTEMS WITH IMPROVED TUNABLE OPTICAL DELAY LINES
App. No. 17/136,383
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TAPE HEATING METHODS
App. No. 17/136,183
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POWER MODULE AND RELATED METHODS
App. No. 17/136,340
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DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS
App. No. 17/136,299
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SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK
App. No. 17/136,136
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IMAGE SENSORS WITH HYBRID ANALOG-TO-DIGITAL CONVERTER ARCHITECTURE
App. No. 17/134,761
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BACKSIDE METAL PHOTOLITHOGRAPHIC PATTERNING DIE SINGULATION SYSTEMS AND RELATED METHODS
App. No. 17/134,717
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METAL-OXIDE-SEMICONDUCTOR CAPACITOR BASED PASSIVE AMPLIFIER
App. No. 17/134,809
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IMAGING SYSTEM WITH TIME-OF-FLIGHT SENSING
App. No. 17/134,726
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METAL-OXIDE-SEMICONDUCTOR CAPACITOR BASED CHARGE SHARING SUCCESSIVE APPROXIMATION REGISTER DATA CONVERTER
App. No. 17/247,794
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DUAL COOL POWER MODULE WITH STRESS BUFFER LAYER
App. No. 17/247,797
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TERMINATION STRUCTURES WITH REDUCED DYNAMIC OUTPUT CAPACITANCE LOSS
App. No. 17/247,796
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INSTABILITY MANAGEMENT IN A SIGNAL DRIVER CIRCUIT
App. No. 17/132,092
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AVERAGE CURRENT AND FREQUENCY CONTROL
App. No. 17/132,343
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MOBILE WIRELESS REPEATER
App. No. 17/132,023
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DIRECT SAMPLING FOR DIGITAL PRE-DISTORTION CALIBRATION
App. No. 17/131,465
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TRANSMUTABLE MIMO WIRELESS TRANSCEIVER
App. No. 17/126,462
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MULTIPLE SUBSTRATE PACKAGE SYSTEMS AND RELATED METHODS
App. No. 17/126,433
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INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPATION MECHANISMS
App. No. 17/247,585
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IMAGE SENSOR WITH BLACK LEVEL CORRECTION
App. No. 17/247,590
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WIRELESS DATA TRANSMISSION
App. No. 17/124,137
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DEFECT REDUCTION OF SEMICONDUCTOR LAYERS AND SEMICONDUCTOR DEVICES BY ANNEAL AND RELATED METHODS
App. No. 17/123,269
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Process of Forming an Electronic Device Including a Doped Gate Electrode
App. No. 17/123,264
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IMAGING SYSTEM WITH TIME-OF-FLIGHT SENSING
App. No. 17/247,522
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MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT
App. No. 17/247,525
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PACKAGING STRUCTURE FOR A SENSOR HAVING A SEALING LAYER
App. No. 17/247,408
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METHODS AND APPARATUS FOR SELECTIVE HISTOGRAMMING
App. No. 17/247,409
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Self-Aligned Trench MOSFET Contacts Having Widths Less Than Minimum Lithography Limits
App. No. 17/114,668
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IMAGE SENSOR WITH ACTIVE CLAMP TO SUPPRESS TRANSFER GATE FEEDTHROUGH
App. No. 17/247,288
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CIRCUIT AND METHOD FOR PROGRAMMING A ONE-TIME PROGRAMMABLE MEMORY
App. No. 17/247,282
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SYSTEM WITH A SPAD-BASED SEMICONDUCTOR DEVICE HAVING DARK PIXELS FOR MONITORING SENSOR PARAMETERS
App. No. 17/247,276
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OFFSET COMPENSATION CIRCUITRY FOR AN AMPLIFICATION CIRCUIT
App. No. 17/247,279
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CONNECTING CLIP DESIGN FOR PRESSURE SINTERING
App. No. 17/247,200
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FIN TRANSISTORS WITH SEMICONDUCTOR SPACERS
App. No. 17/247,212
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CLIP INTERCONNECT WITH MICRO CONTACT HEADS
App. No. 17/110,413
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INDUCTOR CURRENT EMULATION FOR OUTPUT CURRENT MONITORING
App. No. 17/110,011
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SPEAKER EXCURSION PREDICTION AND PROTECTION
App. No. 17/247,156
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ABBREVIATED HEADER COMMUNICATION
App. No. 17/109,547
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REDUCING STRESS CRACKS IN SUBSTRATES
App. No. 17/247,094
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POWER STATE CONTROL FOR MULTI-CHANNEL INTERFACES
App. No. 17/247,095
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METHODS AND APPARATUS FOR HISTOGRAMMING
App. No. 17/247,097
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WIRELESS PREAMBLE DESIGN
App. No. 17/104,288
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SINGULATION SYSTEMS AND RELATED METHODS
App. No. 17/104,302
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SEMICONDUCTOR CAPACITOR DEVICES AND METHODS
App. No. 17/101,981
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ADAPTIVE SPATIAL REUSE
App. No. 17/102,172
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DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES
App. No. 16/949,894
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POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES
App. No. 16/949,896
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POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN
App. No. 16/949,869
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MULTI-LAYERED MICROLENS SYSTEMS AND RELATED METHODS
App. No. 16/951,091
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SEMICONDUCTOR PACKAGES WITH SINGLE-PHOTON AVALANCHE DIODES AND PRISMS
App. No. 16/949,845
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VOLTAGE REFERENCE WITH TEMPERATURE COMPENSATION
App. No. 16/949,836
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SEMICONDUCTOR PACKAGES WITH AN ARRAY OF SINGLE-PHOTON AVALANCHE DIODES SPLIT BETWEEN MULTIPLE SEMICONDUCTOR DICE
App. No. 16/949,837
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JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS
App. No. 16/950,097
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STEERING MATRIX DERIVATION
App. No. 17/099,208
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Electronic Device Including High Electron Mobility Transistors and a Resistor and a Method of Using the Same
App. No. 16/949,735
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RC TIME BASED LOCKED VOLTAGE CONTROLLED OSCILLATOR
App. No. 17/095,117
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TIMING CIRCUIT FOR LOCKING A VOLTAGE CONTROLLED OSCILLATOR TO A HIGH FREQUENCY BY USE OF LOW FREQUENCY QUOTIENTS AND RESISTOR TO SWITCHED CAPACITOR MATCHING
App. No. 17/095,085
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MULTI WIRE BONDING WITH CURRENT SENSING METHOD
App. No. 17/089,842
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IMAGE SENSORS WITH VARIABLE READ OUT CIRCUITRY
App. No. 16/949,540
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SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS
App. No. 17/086,932
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METHODS AND APPARATUS FOR A BATTERY
App. No. 16/949,522
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COMPARATOR SYSTEM HAVING INTERNAL INPUT OFFSET VOLTAGE
App. No. 17/085,247
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SEMICONDUCTOR DEVICE AND METHOD THEREFOR
App. No. 17/083,754
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IMAGING SYSTEMS FOR MULTI-SPECTRAL IMAGING
App. No. 16/949,384
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BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEMS AND RELATED METHODS
App. No. 17/082,579
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUCTURES
App. No. 17/082,512
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CHARGE BALANCED RECTIFIER WITH SHIELDING
App. No. 16/949,394
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SIC MOSFET WITH BUILT-IN SCHOTTKY DIODE
App. No. 16/949,395
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IMAGE SENSORS WITH A PHYSICAL UNCLONABLE FUNCTION
App. No. 16/949,386
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STITCHED INTEGRATED CIRCUIT DIES
App. No. 16/949,324
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ISOLATION IN A SEMICONDUCTOR DEVICE
App. No. 16/949,322
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ISOLATION IN A SEMICONDUCTOR DEVICE
App. No. 16/949,321
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STITCHED INTEGRATED CIRCUIT DIES
App. No. 16/949,323
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GATE DRIVER CIRCUIT
App. No. 16/949,285
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PROPAGATION DELAY COMPENSATION AND INTERPOLATION FILTER
App. No. 16/949,281
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POWER MODULE
App. No. 16/949,262
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QUAD FLAT NO LEADS PACKAGE WITH LOCKING FEATURE
App. No. 17/077,145
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POWER DEVICE WITH A CONTACT HOLE ON A SLOPED ILD REGION
App. No. 16/949,272
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SYSTEMS AND METHODS FOR DESIGNING A DISCRETE DEVICE PRODUCT
App. No. 17/076,039
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Semiconductor Devices with Single-Photon Avalanche Diodes, Light Scattering Structures, and Multiple Deep Trench Isolation Structures
App. No. 16/949,228
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SYSTEMS AND METHODS FOR DESIGNING A MODULE SEMICONDUCTOR PRODUCT
App. No. 17/076,072
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ADAPTABLE LOW DROPOUT (LDO) VOLTAGE REGULATOR AND METHOD THEREFOR
App. No. 16/949,249
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IMAGE SENSORS WITH ADAPTIVE FILTERING FOR ROW NOISE MITIGATION
App. No. 16/949,179
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SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS
App. No. 17/072,521
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NOISE FILTER
App. No. 16/949,167
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POWER DEVICE MODULE WITH DUMMY PAD DIE LAYOUT
App. No. 16/949,130
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RESONANT RECHARGE FOR SYNCHRONOUS PULSED LASER OPERATION
App. No. 16/949,119
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POLYMER RESIN AND COMPRESSION MOLD CHIP SCALE PACKAGE
App. No. 17/068,172
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METHODS OF ALIGNING A SEMICONDUCTOR WAFER FOR SINGULATION
App. No. 17/068,129
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METHODS AND APPARATUS FOR SUCCESSIVE INTRA BLOCK PREDICTION
App. No. 16/949,007
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METHODS AND APPARATUS FOR A SUCCESSIVE APPROXIMATION REGISTER ANALOG-TO-DIGITAL CONVERTER
App. No. 16/948,954
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PRESS-FIT POWER MODULE AND RELATED METHODS
App. No. 17/064,663
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SELF-ALIGNED CONTACT OPENINGS FOR BACKSIDE THROUGH SUBSTRATE VIAS
App. No. 16/948,874
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METHODS AND APPARATUS FOR AN AMPLIFIER CIRCUIT
App. No. 16/948,900
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