Patent Assignment
Reel/Frame 064618/0881
Release of Security Interest in Patents Previously Recorded at Reel 055315, Frame 0350
Recorded: 2023-08-17
Pages: 19
Assignor
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Executed: 2023-08-16
Assignees
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
FAIRCHILD SEMICONDUCTOR CORPORATION
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Properties
(134)
Low Power Shared Image Pixel Architecture
Gate Contact Interlayer for Hemt Devices with Self-Aligned Electrodes
Application:
16/948,785 →
Publication:
US 2022/0020857
Common-Mode Transient Immunity (Cmti) Circuit and Method of Operation Therefor
Lateral Transistor with Extended Source Finger Contact
High-Speed Successive Approximation Analog-to-Digital Converter with Improved Mismatch Tolerance
Method for Defining a Gap Height Within an Image Sensor Package
Termination Structures for Trench-Gate Field-Effect Transistors
Strengthened Wire-Bond
Application:
16/948,794 →
Publication:
US 2022/0020717
Isolated 3D Semiconductor Device Package with Transistors Attached to Opposing Sides of Leadframe Sharing Leads
Methods for Using a Gas Permeable Layer to Form Air Gaps in an Image Sensor
Monolithic Semiconductor Device Assemblies
Image Sensor with Dark Reference Pixel Oversampling
Application:
16/948,802 →
Publication:
US 2022/0014696
Multi-Segment Wire-Bond
Gate Control for Hemt Devices Using Dielectric Between Gate Edges and Gate Field Plates
Application:
16/948,804 →
Publication:
US 2022/0052163
Methods and Apparatus for Computing Parasitic Resistance in a Battery System
Up-Diffusion Suppression in a Power Mosfet
Methods and Apparatus for a Battery System
Methods and Apparatus for a Battery System to Control Leakage at Terminals
Lateral Surge Protection Devices
Self-Aligned Contact Openings for Backside Through Substrate Vias
Structures and Methods for Source-Down Vertical Semiconductor Device
Methods and Apparatus for an Amplifier Circuit
Application:
16/948,900 →
Publication:
US 2021/0021244
Methods and Systems of Power Management for an Integrated Circuit
Methods and Apparatus for a Successive Approximation Register Analog-to-Digital Converter
Methods and Apparatus for Successive Intra Block Prediction
Resonant Recharge for Synchronous Pulsed Laser Operation
Application:
16/949,119 →
Publication:
US 2022/0045479
Power Device Module with Dummy Pad Die Layout
Noise Filter
Image Sensors with Adaptive Filtering for Row Noise Mitigation
Semiconductor Devices with Single-Photon Avalanche Diodes, Light Scattering Structures, and Multiple Deep Trench Isolation Structures
Adaptable Low Dropout (Ldo) Voltage Regulator and Method Therefor
Power Module
Power Device with a Contact Hole on a Sloped Ild Region
Application:
16/949,272 →
Publication:
US 2022/0130969
Propagation Delay Compensation and Interpolation Filter
Gate Driver Circuit
Patent:
11,245,392 →
Application:
16/949,285 →
Isolation in a Semiconductor Device
Isolation in a Semiconductor Device
Patent:
11,257,759 →
Application:
16/949,322 →
Stitched Integrated Circuit Dies
Stitched Integrated Circuit Dies
Imaging Systems for Multi-Spectral Imaging
Image Sensors with a Physical Unclonable Function
Charge Balanced Rectifier with Shielding
Application:
16/949,394 →
Publication:
US 2022/0131016
Sic Mosfet with Built-in Schottky Diode
Methods and Apparatus for a Battery
Image Sensors with Variable Read Out Circuitry
Electronic Device Including High Electron Mobility Transistors and a Resistor and a Method of Using the Same
Voltage Reference with Temperature Compensation
Semiconductor Packages with an Array of Single-Photon Avalanche Diodes Split Between Multiple Semiconductor Dice
Semiconductor Packages with Single-Photon Avalanche Diodes and Prisms
Power Module Package Baseplate with Step Recess Design
Direct-Cooling for Semiconductor Device Modules
Application:
16/949,894 →
Publication:
US 2022/0157688
Power Module Package for Direct Cooling Multiple Power Modules
Jet Ablation Die Singulation Systems and Related Methods
Multi-Layered Microlens Systems and Related Methods
Multiphase Controller with Failure Diagnostic Mechanism
Patent:
11,228,248 →
Application:
17/060,216 →
Semiconductor Devices with Low Resistance Gate and Shield Electrodes and Methods
Out of Order Packet Scheduler
Wap Uplink Optimization by Selection of Mimo Antennas Spatial States
Backside Metal Patterning Die Singulation Systems and Related Methods
Press-Fit Power Module and Related Methods
Methods of Aligning a Semiconductor Wafer for Singulation
Polymer Resin and Compression Mold Chip Scale Package
Semiconductor Package Stress Balance Structures and Related Methods
Systems and Methods for Designing a Discrete Device Product
Systems and Methods for Designing a Module Semiconductor Product
Quad Flat No Leads Package with Locking Feature
Application:
17/077,145 →
Publication:
US 2021/0043550
Semiconductor Device and Method of Forming Micro Interconnect Structures
Backside Metal Patterning Die Singulation Systems and Related Methods
Semiconductor Device and Method Therefor
Comparator System Having Internal Input Offset Voltage
Application:
17/085,247 →
Publication:
US 2021/0048457
Semiconductor Package System and Related Methods
Multi Wire Bonding with Current Sensing Method
Timing Circuit for Locking a Voltage Controlled Oscillator to a High Frequency by Use of Low Frequency Quotients and Resistor to Switched Capacitor Matching
Rc Time Based Locked Voltage Controlled Oscillator
Steering Matrix Derivation
Semiconductor Capacitor Devices and Methods
Application:
17/101,981 →
Publication:
US 2021/0168312
Adaptive Spatial Reuse
Wireless Preamble Design
Singulation Systems and Related Methods
Abbreviated Header Communication
Inductor Current Emulation for Output Current Monitoring
Clip Interconnect with Micro Contact Heads
Application:
17/110,413 →
Publication:
US 2022/0181290
Self-Aligned Trench MOSFET Contacts Having Widths Less Than Minimum Lithography Limits
Process of Forming an Electronic Device Including a Doped Gate Electrode
Defect Reduction of Semiconductor Layers and Semiconductor Devices by Anneal and Related Methods
Wireless Data Transmission
Multiple Substrate Package Systems and Related Methods
Transmutable Mimo Wireless Transceiver
Direct Sampling for Digital Pre-Distortion Calibration
Mobile Wireless Repeater
Instability Management in a Signal Driver Circuit
Average Current and Frequency Control
Backside Metal Photolithographic Patterning Die Singulation Systems and Related Methods
Imaging System with Time-of-Flight Sensing
Image Sensors with Hybrid Analog-to-Digital Converter Architecture
Metal-Oxide-Semiconductor Capacitor Based Passive Amplifier
Semiconductor Package with Wettable Flank
Tape Heating Methods
Semiconductor Substrate Singulation Systems and Related Methods
Spacer with Pattern Layout for Dual Side Cooling Power Module
Dual-Side Cooling Semiconductor Packages and Related Methods
Method of Reducing Residual Contamination in Singulated Semiconductor Die
Power Module and Related Methods
Lidar Systems with Improved Tunable Optical Delay Lines
Application:
17/136,383 →
Publication:
US 2022/0206355
Semiconductor Design Optimization Using at Least One Neural Network
Application:
17/137,773 →
Publication:
US 2022/0207351
High Dynamic Range Image Sensors
Application:
17/137,860 →
Publication:
US 2022/0210353
Semiconductor Device
Reducing Stress Cracks in Substrates
Power State Control for Multi-Channel Interfaces
Methods and Apparatus for Histogramming
Speaker Excursion Prediction and Protection
Connecting Clip Design for Pressure Sintering
Fin Transistors with Semiconductor Spacers
Application:
17/247,212 →
Publication:
US 2022/0181462
System with a Spad-Based Semiconductor Device Having Dark Pixels for Monitoring Sensor Parameters
Offset Compensation Circuitry for an Amplification Circuit
Circuit and Method for Programming a One-Time Programmable Memory
Patent:
11,183,258 →
Application:
17/247,282 →
Image Sensor with Active Clamp to Suppress Transfer Gate Feedthrough
Packaging Structure for a Sensor Having a Sealing Layer
Methods and Apparatus for Selective Histogramming
Application:
17/247,409 →
Publication:
US 2021/0294274
Imaging System with Time-of-Flight Sensing
Module with Substrate Recess for Conductive-Bonding Component
Integration of Semiconductor Device Assemblies with Thermal Dissipation Mechanisms
Image Sensor with Black Level Correction
Metal-Oxide-Semiconductor Capacitor Based Charge Sharing Successive Approximation Register Data Converter
Patent:
11,239,856 →
Application:
17/247,794 →
Termination Structures with Reduced Dynamic Output Capacitance Loss
Dual Cool Power Module with Stress Buffer Layer
Offset Cancel Method for a Resolver Type Sensor
Application:
63/109,181 →
Ultrasonic Sensor System
Application:
63/124,266 →
Ultrasonic Sensor System
Application:
63/127,599 →
Zvs Flyback
Application:
63/198,200 →
Equalizing Channels in Ultrasonic Dual Channel System
Application:
63/198,768 →
Trench Poly Diode and Resistor Layouts for Shielded Gate Mosfets
Application:
63/199,130 →
Methods and Apparatus for Optical Image Stabilization
Application:
63/199,256 →
Short Circuit Detection Circuit
Application:
63/199,351 →
Related Assignments
(21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 1, 2020
From: JOHNSON, RICHARD SCOTT; GURUARIBAM, DEBASHREE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053950/0637 →
Assignment of Assignor's Interest
Oct 1, 2020
From: CONSTANT, AURORE; COPPENS, PETER
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053950/0796 →
Assignment of Assignor's Interest
Oct 1, 2020
From: JIN, WOOKANG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053950/0876 →
Assignment of Assignor's Interest
Oct 1, 2020
From: JEON, WOOCHUL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053950/0967 →
Assignment of Assignor's Interest
Oct 1, 2020
From: HSIEH, YU-TE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053951/0313 →
Assignment of Assignor's Interest
Oct 1, 2020
From: OGURA, TAKASHI; HIROSHIMA, TAKASHI; TANIGUCHI, TOSHIMITSU
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053951/0868 →
Assignment of Assignor's Interest
Oct 1, 2020
From: XIA, WUXING; LIU, JINGYAN; LI, HUAPING; JIA, ZHENGXU
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053952/0040 →
Assignment of Assignor's Interest
Oct 1, 2020
From: MALDO, TIBURCIO A.; LEE, KEUNHYUK; TEYSSEYRE, JEROME
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053952/0253 →
Assignment of Assignor's Interest
Oct 1, 2020
From: CHAPMAN, NATHAN WAYNE; VAARTSTRA, BRIAN ANTHONY; VU, AMANDA THUY TRANG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053952/0362 →
Assignment of Assignor's Interest
Oct 1, 2020
From: MOENS, PETER; GRIVNA, GORDON M.; LIN, YUSHENG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053952/0511 →
Assignment of Assignor's Interest
Oct 1, 2020
From: BAYRON, ELMER CUNANAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053952/0834 →
Assignment of Assignor's Interest
Oct 1, 2020
From: COPPENS, PETER; CONSTANT, AURORE; VANMEERBEEK, PIET
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053952/0936 →
Assignment of Assignor's Interest
Oct 1, 2020
From: KONDO, HIDEO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053952/0982 →
Assignment of Assignor's Interest
Oct 1, 2020
From: VENKATRAMAN, PRASAD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053953/0072 →
Assignment of Assignor's Interest
Oct 1, 2020
From: KONDO, HIDEO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053953/0181 →
Assignment of Assignor's Interest
Oct 1, 2020
From: KONDO, HIDEO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053953/0245 →
Assignment of Assignor's Interest
Oct 1, 2020
From: MUDEGOWDAR, ISHWAR CHANDRA; PANKRAC, TOMAS
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053966/0769 →
Assignment of Assignor's Interest
Oct 1, 2020
From: SPIESSENS, PETER
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053967/0278 →
Assignment of Assignor's Interest
Oct 5, 2020
From: GRIVNA, GORDON M.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053971/0253 →
Assignment of Assignor's Interest
Oct 5, 2020
From: ONISHI, AKINBOU
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053977/0038 →
Security Interest
Feb 17, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 055315/0350 →