Power device module with dummy pad die layout
A method includes disposing a plurality of active solder pads and at least one mechanical support solder pad on the substrate. The plurality of active solder pads provide areas for mechanical bonding of the substrate to at least one device contact pad disposed on a semiconductor die. The at least one mechanical support solder pad provides an area for mechanical bonding of the substrate to at least one dummy device contact pad disposed on the semiconductor die. The method further includes mechanically bonding the substrate to the semiconductor die by forming solder joints between the plurality of active solder pads and the at least one device contact pad, and between the at least one mechanical support pad and the at least one dummy device contact pad.
1. A package, comprising:
a semiconductor die;
a substrate; and
a layout of solder pads disposed on a conductive trace on the substrate, the solder pads providing areas for mechanically bonding the substrate to the semiconductor die, the layout of solder pads including:
a plurality of active solder pads providing electrical connections to an electronic device formed in the semiconductor die; and
a mechanical support solder pad providing an area in addition to an area provided by the plurality of active solder pads for mechanical bonding of the substrate to the semiconductor die.
2. The package of claim 1 , wherein the mechanical support solder pad mechanically bonds a corner portion of the substrate to the semiconductor die.
3. The package of claim 1 , wherein the plurality of active solder pads are disposed bisymmetrically about a sagittal axis of the semiconductor die.
4. The package of claim 1 , wherein the plurality of active solder pads includes at least one emitter contact solder pad and at least one active signal sense contact solder pad, and wherein the at least one active signal sense contact solder pad is electrically connected to a corresponding one of a plurality of signal sense contact pads disposed in a row on the semiconductor die.
5. The package of claim 4 , wherein the mechanical support solder pad is disposed on a longitudinal end of the row of the plurality of signal sense contact pads disposed on the semiconductor die.
6. The package of claim 1 , wherein the mechanical support solder pad is electrically isolated from the electronic device formed in the semiconductor die.
7. The package of claim 1 , wherein the mechanical support solder pad is electrically connected to the electronic device formed in the semiconductor die via a device contact pad disposed on the semiconductor die.
8. The package of claim 1 , wherein the substrate is a direct bonded copper (DBC) substrate.
9. A package, comprising:
a semiconductor die;
a substrate;
an active solder pad disposed on the substrate, the active solder pad being mechanically bonded to a device contact pad disposed on the semiconductor die; and
a mechanical support solder pad disposed on the substrate, the mechanical support solder pad being mechanically bonded to a dummy device contact pad disposed on the semiconductor die, the dummy device contact pad extending to an emitter contact pad disposed on the semiconductor die.
10. The package of claim 9 , wherein the dummy device contact pad is disposed on a corner portion of the substrate and is electrically isolated from an electronic device formed in the semiconductor die.
11. The package of claim 9 , wherein the dummy device contact pad is disposed on a corner portion of the substrate and is electrically connected to an electronic device formed in the semiconductor die via the device contact pad disposed on the semiconductor die.
12. The package of claim 9 , wherein the device contact pad disposed on the semiconductor die includes at least one signal sense contact pad disposed in a row alongside an edge of the semiconductor die, and the dummy device contact pad is disposed on the semiconductor die at a corner of the semiconductor die on an end of the row.
13. The package of claim 9 , wherein the mechanical support solder pad is included in a plurality of mechanical support solder pads disposed on the substrate at a position closer to a corner of the semiconductor die than to a sagittal axis of the semiconductor die.
14. A package, comprising:
an electronic device formed in a semiconductor die;
a plurality of device contact pads disposed on a surface of the semiconductor die, the plurality of device contact pads being electrically connected to the electronic device, the plurality of device contact pads including at least an emitter contact pad and a signal sense contact pad; and
a dummy device contact pad disposed on the surface of the semiconductor die, the dummy device contact pad providing an area for a solder joint between the semiconductor die and a substrate in addition to an area provided by the plurality of device contact pads.
15. The package of claim 14 , wherein the dummy device contact pad is disposed on the surface at a position closer to a corner of the semiconductor die than to a sagittal axis of the semiconductor die.
16. The package of claim 14 , wherein the plurality of device contact pads are disposed bisymmetrically about a sagittal axis on the surface of the semiconductor die.
17. The package of claim 14 , wherein the signal sense contact pad is included in a plurality of signal sense contact pads disposed in a row on the surface along an edge of the semiconductor die.
18. The package of claim 17 , wherein the plurality of signal sense contact pads include at least one dummy device contact pad disposed on a longitudinal end of the row of the plurality of signal sense contact pads disposed on the surface along the edge of the semiconductor die.
19. The package of claim 14 , wherein the dummy device contact pad is electrically isolated from the electronic device formed in the semiconductor die.
20. The package of claim 14 , wherein the dummy device contact pad is electrically connected to the electronic device via one of the plurality of device contact pads.