Multi-segment wire-bond

1. A multi-segment wire-bond comprising:

a heel portion that includes multiple segments, the multiple segments including:

a first segment that increases from a first thickness to a second thickness according to a first side cross-sectional profile over a first segment length;

a second segment that increases from the second thickness to a third thickness according to a second side cross-sectional profile over a second segment length, the second profile being different from the first profile; and

a third segment that increases from the third thickness to a fourth thickness according to a third side cross-sectional profile over a third segment length, the third profile being different from the second profile and the first profile, wherein the third profile includes a curve disposed between a first radius and a second radius, the curve formed during wire bonding by a force applied by a tip face of a multifaceted capillary having a corresponding curve defined by the first radius and the second radius of the capillary;

the heel portion having continuous contact between a bonding surface and the first segment, the second segment, and the third segment.

2. The multi-segment wire-bond according to claim 1 , wherein:

the first profile is a substantially linear increase from a bond thickness of a bond portion that is adjacent to the first segment to the second thickness.

3. The multi-segment wire-bond according to claim 1 , wherein:

the second profile is a substantially linear increase from the second thickness to the third thickness over the second segment length.

4. The multi-segment wire-bond according to claim 1 , wherein:

the third profile includes an increase from the third thickness to a wire thickness of a wire portion that is adjacent to the third segment.

5. The multi-segment wire-bond according to claim 1 , wherein:

the curve increases an average thickness of the heel portion is thicker than without the curve.

6. The multi-segment wire-bond according to claim 1 , wherein:

the curve defines a plateau region in the third segment, the third segment adjacent to a wire portion, the plateau region having a top surface substantially parallel to the bonding surface.

7. The multi-segment wire-bond according to claim 6 , wherein:

the plateau region has a plateau thickness that is greater than or equal to 50% of a diameter of a wire portion, the third segment being disposed between the second segment and the wire portion.

8. The multi-segment wire-bond according to claim 1 , further including:

a bond portion, adjacent to the first segment of the heel portion, that is bonded to a bonding surface of a substrate;

a wire portion adjacent to the third segment of the heel portion such that the third segment is disposed between the wire portion and the second segment, the wire portion having a bottom surface not bonded to the bonding surface of the substrate; and

the third segment having a bottom surface bonded to the bonding surface of the substrate in, at least, an area under a plateau region of the third segment that is defined by the curve.

9. A multifaceted capillary for a wire-bonding machine, the multifaceted capillary comprising:

a wire channel;

a first face having a first face profile that includes a first surface at a first face angle with respect to a bonding surface;

a second face having a second face profile that includes a second surface at a second face angle with respect to the bonding surface, the second face angle being different than the first face angle, the first face being disposed between the second face and the wire channel; and

a third face having a third face profile that includes a curve having a plateau region that is substantially aligned parallel with the bonding surface, the second face being disposed between the first face and the third face, wherein a third force applied by the third face on a wire during wire-bonding is larger than a first force applied by the first face or a second force applied by the second face.

10. The multifaceted capillary for a wire-bonding machine according to claim 9 , wherein:

the first face angle is greater than zero degrees and less than or equal to approximately 4 degrees; and

the second face angle is greater than approximately 4 degrees and less than or equal to approximately 8 degrees.

11. The multifaceted capillary for a wire-bonding machine according to claim 9 , wherein:

the curve is defined by a first radius and a second radius; and

the third face profile includes a third surface at a third face angle plus the curve defined by the first radius and the second radius.

12. The multifaceted capillary for a wire-bonding machine according to claim 11 , wherein:

the third face angle is greater than or equal to 15 degrees;

the first radius is less than or equal to 0.5 mils; and

the second radius is greater than or equal 0.5 mils and less than or equal to 1 mils.

13. The multifaceted capillary for a wire-bonding machine according to claim 9 , wherein:

the first face is a first face length that is less than or equal to 0.6 mils;

the second face is a second face length that is greater than or equal to 0.75 mils; and

the third face is a third face length that is less than or equal to 1 mils.

14. The multifaceted capillary for a wire-bonding machine according to claim 9 , wherein:

the first face, the second face, and the third face define a height that is less than a diameter of a wire.

15. The multifaceted capillary for a wire-bonding machine, according to claim 14 , wherein:

the diameter of the wire is 1 mil or 2 mils.