Defect reduction of semiconductor layers and semiconductor devices by anneal and related methods
Systems and methods of the disclosed embodiments include reducing defects in a semiconductor layer. The defects may be reduced by forming the semiconductor layer on a substrate, removing at least a portion the substrate from an underside of the semiconductor layer, and annealing the semiconductor layer to reduce the defects in the layer. The annealing includes focusing energy at the layer.
1. A method, comprising:
growing a semiconductor layer on a substrate;
removing at least a portion of the substrate from an underside portion of the semiconductor layer;
annealing the semiconductor layer to reduce a number of defects in the semiconductor layer using a laser directed to at least a topside portion of the semiconductor layer while supporting the semiconductor layer with a support structure during annealing to prevent sagging of the semiconductor layer; and
replacing the at least the portion of the substrate with a replaced substrate layer.
2. The method of claim 1 , wherein the semiconductor layer includes gallium nitride (GaN), aluminum GaN, silicon carbide, gallium arsenide, diamond, gallium oxide, or any combinations thereof.
3. The method of claim 2 , wherein the semiconductor layer comprises an additional layer comprising aluminum nitride (AlN), silicon nitride, silicon oxide, or any combinations thereof.
4. The method of claim 1 , wherein the semiconductor layer comprises an aluminum gallium nitride (AlGaN) layer, and the AlGaN layer includes 5 percent to 50 percent aluminum.
5. The method of claim 4 , wherein aluminum content in the AlGaN layer is greater than 27.5 percent.
6. The method of claim 1 , wherein the laser comprises a short-wavelength laser.
7. The method of claim 1 , wherein the annealing comprises focusing the laser on selected areas of the semiconductor layer and masking the laser from unselected areas of the semiconductor layer.
8. The method of claim 1 , wherein removing at least the portion of the substrate comprises a Taiko process.
9. The method of claim 1 , wherein removing at least the portion of the substrate comprises removing a central portion of the substrate and not removing an outer support ring of the substrate.
10. The method of claim 1 , further comprising filling in the substrate on the underside portion of the semiconductor layer.
11. The method of claim 1 , further comprising growing additional gallium nitride (GaN) on the semiconductor layer after the semiconductor layer has been annealed.
12. The method of claim 1 , wherein growing the semiconductor layer comprises epitaxially growing a layer of GaN.
13. The method of claim 1 , wherein the laser is directed to a location above where the portion of the substrate was removed.
14. A method of fabricating a semiconductor device, comprising:
growing a layer of gallium nitride (GaN) on a substrate layer;
removing at least a portion of the substrate layer from the layer of GaN and not removing an outer support ring of the substrate layer;
after the at least the portion of the substrate layer has been removed, annealing the layer of GaN to reduce defects in the layer of GaN;
replacing the at least the portion of the substrate layer with a replaced substrate layer within the outer support ring; and
forming a gate, a source, and a drain on the layer of GaN.
15. The method of claim 14 , further comprising growing additional GaN after the annealing the layer of GaN and before forming the gate, the source, and the drain.
16. The method of claim 15 , further comprising attaching a back metal directly contacting the layer of GaN.
17. The method of claim 14 , wherein annealing the layer of GaN comprises annealing with a laser.
18. The method of claim 14 , further comprising growing additional GaN on the layer of GaN after the layer of GaN has been annealed.
19. A method, comprising:
growing a semiconductor layer on a substrate;
removing at least a portion of the substrate to expose an underside portion of the semiconductor layer and not removing an outer support;
annealing the semiconductor layer to reduce a number of defects in the semiconductor layer using a laser directed from a bottom of the semiconductor layer toward the underside portion of the semiconductor layer;
replacing the at least the portion of the substrate with a replaced substrate layer within the outer support; and
forming a gate, a source, and a drain on a topside of the semiconductor layer.
20. The method of claim 19 , wherein annealing the semiconductor layer includes directing laser energy to the topside of the semiconductor layer opposite the underside portion of the semiconductor layer.