Semiconductor devices with single-photon avalanche diodes, light scattering structures, and multiple deep trench isolation structures
An imaging device may include single-photon avalanche diodes (SPADs). To improve the sensitivity and signal-to-noise ratio of the SPADs, light scattering structures may be formed in the semiconductor substrate to increase the path length of incident light through the semiconductor substrate. To mitigate crosstalk, multiple rings of isolation structures may be formed around the SPAD. An outer deep trench isolation structure may include a metal filler such as tungsten and may be configured to absorb light. The outer deep trench isolation structure therefore prevents crosstalk between adjacent SPADs. Additionally, one or more inner deep trench isolation structures may be included. The inner deep trench isolation structures may include a low-index filler to reflect light and keep incident light in the active area of the SPAD.
1. A semiconductor device comprising:
a substrate having a thickness;
a single-photon avalanche diode in the substrate;
a first deep trench isolation structure in the substrate that forms a first ring around the single-photon avalanche diode; and
a second deep trench isolation structure in the substrate that forms a second ring around the single-photon avalanche diode, wherein the second deep trench isolation structure has a depth that is less than the thickness.
2. The semiconductor device defined in claim 1 , wherein the first deep trench isolation structure comprises a trench and a metal filler in the trench.
3. The semiconductor device defined in claim 2 , wherein the metal filler comprises tungsten.
4. A semiconductor device comprising:
a substrate having a thickness;
a single-photon avalanche diode in the substrate;
a first deep trench isolation structure in the substrate that forms a first ring around the single-photon avalanche diode; and
a second deep trench isolation structure in the substrate that forms a second ring around the single-photon avalanche diode, wherein the second deep trench isolation structure has a depth that is less than the thickness, wherein the first deep trench isolation structure comprises a trench and a metal filler in the trench, and wherein the metal filler is coupled to a bias voltage and serves as an anode contact for the single-photon avalanche diode.
5. The semiconductor device defined in claim 1 , wherein the first deep trench isolation structure comprises a trench and a light absorbing filler in the trench.
6. The semiconductor device defined in claim 5 , wherein the second deep trench isolation structure comprises an additional trench and a low-index filler in the additional trench.
7. The semiconductor device defined in claim 1 , wherein the second deep trench isolation structure is interposed between the first deep trench isolation structure and the single-photon avalanche diode.
8. The semiconductor device defined in claim 7 , wherein the first deep trench isolation structure is configured to absorb light and wherein the second deep trench isolation structure is configured to reflect light.
9. The semiconductor device defined in claim 7 , wherein the first deep trench isolation structure is a front side deep trench isolation structure and wherein the second deep trench isolation structure is a backside deep trench isolation structure.
10. The semiconductor device defined in claim 1 , further comprising:
a plurality of light scattering structures in the substrate over the single-photon avalanche diode.
11. The semiconductor device defined in claim 1 , wherein the second deep trench isolation structure comprises a trench in the substrate and a p-type doped liner adjacent to the trench.
12. The semiconductor device defined in claim 11 , wherein the p-type doped liner is coupled to a bias voltage and serves as an anode contact for the single-photon avalanche diode.
13. A semiconductor device comprising:
a substrate;
a single-photon avalanche diode in the substrate;
an outer ring-shaped deep trench isolation structure having a central opening, wherein the single-photon avalanche diode is in the central opening; and
an inner ring-shaped deep trench isolation structure that surrounds the single-photon avalanche diode and that is in the central opening, wherein the inner ring-shaped deep trench isolation structure is interposed between the single-photon avalanche diode and the outer ring-shaped deep trench isolation structure and wherein the inner ring-shaped deep trench isolation structure is more reflective than the outer ring-shaped deep trench isolation structure.
14. The semiconductor device defined in claim 1 , wherein the first deep trench isolation structure forms the first ring around the single-photon avalanche diode within a given plane, wherein the second deep trench isolation structure forms the second ring around the single-photon avalanche diode within the given plane, wherein the second deep trench isolation structure is interposed between the first deep trench isolation structure and the single-photon avalanche diode within the given plane, wherein the first deep trench isolation structure extends completely through the thickness of the substrate, wherein the first deep trench isolation structure comprises a first trench and a first filler in the first trench, wherein the second deep trench isolation structure comprises a second trench and a second filler in the second trench, and wherein the second filler is more reflective than the first filler.
15. The semiconductor device defined in claim 13 , wherein the substrate has a thickness, wherein the outer ring-shaped deep trench isolation structure extends completely through the thickness of the substrate, and wherein the inner ring-shaped deep trench isolation structure has a depth that is less than the thickness.
16. The semiconductor device defined in claim 4 , wherein the first deep trench isolation structure extends completely through the thickness of the substrate.
17. The semiconductor device defined in claim 4 , wherein the second deep trench isolation structure extends only partially through the thickness of the substrate.
18. The semiconductor device defined in claim 13 , wherein the outer ring-shaped deep trench isolation structure comprises a trench and a metal filler in the trench and wherein the metal filler is coupled to a bias voltage and serves as an anode contact for the single-photon avalanche diode.
19. The semiconductor device defined in claim 13 , wherein the inner ring-shaped deep trench isolation structure comprises a trench in the substrate and a p-type doped liner adjacent to the trench and wherein the p-type doped liner is coupled to a bias voltage and serves as an anode contact for the single-photon avalanche diode.
20. The semiconductor device defined in claim 15 , wherein the substrate has first and second opposing sides and wherein the semiconductor device further comprises:
a plurality of light scattering structures in the first side of the substrate over the single-photon avalanche diode, wherein the inner ring-shaped deep trench isolation structure extends from the second side of the substrate towards the first side of the substrate.