Lateral transistor with extended source finger contact
Semiconductor devices, such as a lateral HEMT, may display current flow between a plurality of interdigitated source fingers and drain fingers, and controlled by a common gate connection. An extended source finger contact may enable improved voltage control across the source fingers, even for large devices with many and/or lengthy source fingers. In this way, unwanted subthreshold operations and switching oscillations may be avoided by reliably maintaining a source voltage at a desired level, to thereby provide fast and reliable switching.
1. A semiconductor device, comprising:
a plurality of source fingers in a first plane;
a source pad in a second plane and connected to the plurality of source fingers;
a plurality of drain fingers in the first plane and interdigitated with the plurality of source fingers;
a drain pad in the second plane and connected to the plurality of drain fingers;
a gate pad connected to a gate and to a gate feed that extends at least partially around the source pad and the drain pad; and
an extended source finger contact in the second plane and connected to the source pad and to a source finger of the plurality of source fingers, and extending in parallel with the source finger and at least partially around the drain pad.
2. The semiconductor device of claim 1 , wherein the source finger is an outermost source finger at an edge of the plurality of source fingers.
3. The semiconductor device of claim 1 , further comprising a second extended source finger contact connected to the source pad and to a second source finger of the plurality of source fingers, and extending in parallel with the second source finger in a direction of the drain pad.
4. The semiconductor device of claim 1 , wherein the extended source finger contact encloses the drain pad within the second plane, and connects with the source pad at a first edge of the source pad and a second edge of the source pad, and connects with end portions of the plurality of source fingers.
5. The semiconductor device of claim 1 , wherein the extended source finger contact has a thickness at least twice that of the source finger.
6. The semiconductor device of claim 1 , wherein at least one source finger is included in the plurality of source fingers that has a relatively larger cross-sectional area than remaining source fingers of the plurality of source fingers.
7. The semiconductor device of claim 6 , wherein the at least one source finger having the relatively larger cross-sectional area is the source finger.
8. The semiconductor device of claim 6 , wherein the at least one source finger having the relatively larger cross-sectional area is a central source finger within a central portion of the plurality of source fingers.
9. The semiconductor device of claim 1 , wherein the gate feed includes a gate feed portion that extends between an inter-pad space between the source pad and the drain pad.
10. The semiconductor device of claim 1 , wherein the extended source finger contact is at least partially within the gate feed.
11. The semiconductor device of claim 1 , wherein the semiconductor device includes at least one lateral GAN HEMT transistor.
12. A semiconductor device, comprising:
a plurality of drain fingers in a first plane;
a drain pad in a second plane and connected to the plurality of drain fingers;
a plurality of source fingers in the first plane that are parallel to, and interdigitated with, the plurality of drain fingers;
a source pad in the second plane and connected to the plurality of source fingers;
a gate pad connected to a gate feed that extends around at least a portion of the source pad or the drain pad; and
an extended source finger contact in the second plane and connected to the source pad and extending in a direction of the drain pad, at least partially around the drain pad, and at least partially within the gate feed.
13. The semiconductor device of claim 12 , wherein the extended source finger contact is connected to a source finger of the plurality of source fingers, and extends in parallel with the source finger in the direction of the drain pad.
14. The semiconductor device of claim 12 , wherein the gate feed includes a gate feed portion that extends between an inter-pad space between the source pad and the drain pad.
15. A method of making a semiconductor device, comprising:
connecting a plurality of source fingers in a first plane to a source pad in a second plane;
connecting a drain pad in the second plane to a plurality of drain fingers that are interdigitated with the plurality of source fingers within the first plane;
connecting a gate pad to a gate and to a gate feed that extends at least partially around the source pad and the drain pad; and
connecting an extended source finger contact in the second plane to the source pad and to a source finger of the plurality of source fingers, wherein the extended source finger contact extends in parallel with the source finger and at least partially around the drain pad.
16. The method of claim 15 , wherein connecting the extended source finger contact comprises:
connecting the extended source finger contact to the source finger with the source finger being an outermost source finger at an edge of the plurality of source fingers.
17. The method of claim 15 , wherein connecting the extended source finger contact comprises:
connecting a second extended source finger contact to the source pad and to a second source finger of the plurality of source fingers, and extending in parallel with the second source finger in a direction of the drain pad.
18. The method of claim 15 , wherein the extended source finger contact has a thickness at least twice that of the source finger.
19. The method of claim 15 , wherein at least one source finger is included in the plurality of source fingers that has a relatively larger cross-sectional area than remaining source fingers of the plurality of source fingers.
20. The method of claim 15 , wherein the gate feed includes a gate feed portion that extends between an inter-pad space between the source pad and the drain pad.