Power module package for direct cooling multiple power modules
According to an aspect, a power module package includes a plurality of power modules including a first power module and a second power module, a plurality of heat sinks including a first heat sink coupled to the first power module and a second heat sink coupled to the second power module, and a module carrier coupled to the plurality of power modules, where the module carrier includes a first region defining a first heat-sink slot and a second region defining a second heat-sink slot. The first heat sink extends at least partially through the first heat-sink slot and the second heat sink extends at least partially through the second heat-sink slot. The power module package includes a housing coupled to the module carrier and a ring member located between the module carrier and the housing.
1. A power module package for direct cooling multiple power modules, the power module package comprising:
a plurality of power modules including a first power module and a second power module;
a plurality of heat sinks including a first heat sink coupled to the first power module and a second heat sink coupled to the second power module;
a module carrier coupled to the plurality of power modules, the module carrier including a first region defining a first heat-sink slot and a second region defining a second heat-sink slot, the first heat sink extending at least partially through the first heat-sink slot, the second heat sink extending at least partially through the second heat-sink slot;
a housing coupled to the module carrier, the module carrier being disposed between the housing and the plurality of power modules; and
a ring member located between the module carrier and the housing.
2. The power module package of claim 1 , wherein the first heat sink includes metal pin fins.
3. The power module package of claim 1 , wherein the first region includes at least one positioning guide configured to align at least one of the first power module or the first heat sink.
4. The power module package of claim 1 , wherein the module carrier includes a plastic material.
5. The power module package of claim 1 , wherein the plurality of power modules include a third power module and the plurality of heat sinks include a third heat sink coupled to the third power module, wherein the module carrier including a third region defining a third heat-sink slot, the third heat sink extending at least partially through the third heat-sink slot.
6. The power module package of claim 5 , wherein each of the first power module, the second power module, and the third power module correspond to a separate phase of a three phase current of an inverter.
7. The power module package of claim 5 , wherein the ring member includes an O-ring that extends around the first power module, the second power module, and the third power module, collectively.
8. The power module package of claim 1 , wherein the first power module includes a half-bridge module.
9. The power module package of claim 1 , wherein the module carrier is coupled to the housing via one or more fasteners.
10. A power module package for direct cooling multiple power modules, the power module package comprising:
a plurality of power modules including a first power module, a second power module, and a third power module;
a plurality of heat sinks including a first heat sink coupled to the first power module, a second heat sink coupled to the second power module, and a third heat sink coupled to the third power module;
a module carrier coupled to the plurality of power modules, the module carrier including a first region defining a first heat-sink slot, a second region defining a second heat-sink slot, and a third region defining a third heat-sink slot, the first heat sink extending at least partially through the first heat-sink slot, the second heat sink extending at least partially through the second heat-sink slot, the third heat sink extending at least partially through the third heat-sink slot; and
a housing coupled to the module carrier, the housing being coupled to the module carrier being located between the housing and the plurality of power modules.
11. The power module package of claim 10 , further comprising:
a ring member located between the module carrier and a surface of the housing.
12. The power module package of claim 10 , wherein the first region defines one or more module positioning guides.
13. The power module package of claim 10 , wherein the first region defines one or more heat-sink positioning guides.
14. The power module package of claim 10 , wherein each of the first power module, the second power module, and the third power module correspond to a separate phase of a three phase current of an inverter.
15. The power module package of claim 10 , wherein each of the first heat sink, the second heat sink, and the third heat sink include metal pin fins.
16. The power module package of claim 10 , wherein the module carrier includes a metal-based material.