Integration of semiconductor device assemblies with thermal dissipation mechanisms

1. An electronic device assembly comprising:

a semiconductor device assembly including:

a ceramic substrate;

a patterned metal layer disposed on a first surface of the ceramic substrate; and

a semiconductor die disposed on the patterned metal layer; and

a water jacket having a recess, the ceramic substrate having a second surface that is direct-bonded to a plurality of cooling fins of the water jacket, the second surface of the ceramic substrate being opposite the first surface of the ceramic substrate and defining a portion of a fluidic channel of the water jacket, the plurality of cooling fins being disposed within the fluidic channel of the water jacket.

2. The electronic device assembly of claim 1 , wherein the second surface of the ceramic substrate is direct-bonded to the plurality of cooling fins using diffusion bonding.

3. The electronic device assembly of claim 1 , wherein the second surface of the ceramic substrate is direct-bonded to the plurality of cooling fins using brazing.

4. The electronic device assembly of claim 1 , further comprising a molding compound encapsulating the semiconductor device assembly, the molding compound being disposed in the recess.

5. The electronic device assembly of claim 4 , further comprising:

a cover, the cover being disposed on the molding compound; and

at least one signal pin coupled with the ceramic substrate, the at least one signal pin extending through the molding compound and the cover.

6. An electronic device assembly comprising:

a first semiconductor device assembly including:

a first ceramic substrate;

a first patterned metal layer disposed on a first surface of the first ceramic substrate; and

a first semiconductor die disposed on the first patterned metal layer;

a second semiconductor device assembly including:

a second ceramic substrate;

a second patterned metal layer disposed on a first surface of the second ceramic substrate; and

a second semiconductor die disposed on the second patterned metal layer; and

a water jacket having at least a first recess and a second recess, the first ceramic substrate having a second surface that is direct-bonded to a plurality of cooling fins of the water jacket in the first recess and defining a portion of a fluidic channel of the water jacket, the plurality of cooling fins being disposed within the fluidic channel of the water jacket, and ceramic material of a second surface of the second ceramic substrate being direct-bonded to the water jacket in the second recess,

the second surface of the first ceramic substrate being opposite the first surface of the first ceramic substrate, and

the second surface of the second ceramic substrate being opposite the first surface of the second ceramic substrate.

7. The electronic device assembly of claim 6 , wherein the first ceramic substrate and the second ceramic substrate are direct-bonded to the water jacket using one of diffusion bonding or brazing.

8. The electronic device assembly of claim 6 , wherein:

the plurality of cooling fins is a first plurality of cooling fins of the water jacket;

the portion of the fluidic channel is a first portion of the fluidic channel; and

a second plurality of cooling fins of the water jacket are direct-bonded to the second ceramic substrate, the second ceramic substrate defining a second portion of a fluidic channel of the water jacket.

9. The electronic device assembly of claim 6 , further comprising:

a molding compound respectively encapsulating the first semiconductor device assembly and the second semiconductor device assembly;

a first signal pin configured for press-fit insertion coupled with the first ceramic substrate, the first signal pin extending through respective molding compound of the first semiconductor device assembly; and

a second signal pin configured for press-fit insertion coupled with the second ceramic substrate, the second signal pin extending through respective molding compound of the second semiconductor device assembly.

10. The electronic device assembly of claim 9 , wherein the respective molding compound of the first semiconductor device assembly is disposed in the first recess.

11. The electronic device assembly of claim 9 , further comprising a cover that is disposed on the respective molding compound of the first semiconductor device assembly, the first signal pin extending through the cover.

12. An electronic device assembly comprising:

a semiconductor device assembly including:

a ceramic substrate;

a first metal layer disposed on a first surface of the ceramic substrate;

a second metal layer disposed on a second surface of the ceramic substrate, the second surface being opposite the first surface; and

a semiconductor die coupled with the first metal layer; and

a water jacket having a recess, the semiconductor device assembly being diffusion-bonded to a plurality of cooling fins disposed within a fluidic channel of the water jacket in the recess, at least one of the second metal layer or the second surface of the ceramic substrate defining a portion of a fluidic channel of the water jacket.

13. The electronic device assembly of claim 12 , wherein the second metal layer of the semiconductor device assembly is diffusion-bonded to the plurality of cooling fins via a metal plate.

14. The electronic device assembly of claim 12 , further comprising a molding compound encapsulating the semiconductor device assembly, the molding compound being disposed in the recess.

15. The electronic device assembly of claim 12 , further comprising:

a molding compound encapsulating the semiconductor device assembly;

a cover disposed on the molding compound; and

at least one signal pin coupled with the ceramic substrate, the at least one signal pin extending through the molding compound and the cover.