Patent Assignment
Reel/Frame 054027/0701
Assignment of Assignor's Interest
Recorded: 2020-10-12
Pages: 7
Assignors
LIN, YUSHENG
Executed: 2016-05-25
WANG, SOON WEI
Executed: 2016-05-24
CHEW, CHEE HIONG
Executed: 2016-05-24
CARNEY, FRANCIS J.
Executed: 2016-05-25
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Polymer Resin and Compression Mold Chip Scale Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 17, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 055315/0350 →
Release of Security Interest in Patents Previously Recorded at Reel 055315, Frame 0350
Aug 17, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064618/0881 →