Patent Assignment
Reel/Frame 054030/0432
Assignment of Assignor's Interest
Recorded: 2020-10-12
Pages: 10
Assignors
SON, DONG WON
Executed: 2020-09-24
SHIN, JONG HO
Executed: 2020-09-25
LIM, SUNG JAE
Executed: 2020-09-25
CHOI, SUNG HO
Executed: 2020-09-25
KIM, BYEONGHOON
Executed: 2020-09-25
KIM, CHANGOH
Executed: 2020-10-08
CHO, SUNGWON
Executed: 2020-10-06
PARK, KYOUNGHEE
Executed: 2020-10-07
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
EMI Shielding for Flip Chip Package with Exposed Die Backside
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the 1ST Inventor's Execution Date Previously Recorded at Reel: 054030 Frame: 0432. Assignor(S) Hereby Confirms the Assignment .
Sep 1, 2022
From: SON, DONG WON; SHIN, JONG HO; LIM, SUNG JAE; CHOI, SUNG HO
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 061369/0746 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →