Patent Assignment
Reel/Frame 054044/0748
Assignment of Assignor's Interest
Recorded: 2020-10-14
Pages: 4
Assignors
LIN, YU-MIN
Executed: 2020-09-22
LIN, ANG-YING
Executed: 2020-09-22
WU, SHENG-TSAI
Executed: 2020-09-22
CHEN, CHAO-JUNG
Executed: 2020-09-22
NI, TZU-HSUAN
Executed: 2020-09-22
HUANG, SHIN-YI
Executed: 2020-09-22
LO, YUAN-YIN
Executed: 2020-10-05
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG,, HSINCHU, 310401, TAIWAN
Covered Property
(1)
Multi-Chip Package and Manufacturing Method Thereof