Patent Assignment
Reel/Frame 054057/0616
Assignment of Assignor's Interest
Recorded: 2020-10-14
Pages: 5
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Semiconductor Package Having Step Cut Sawn into Molding Compound Along Perimeter of the Semiconductor Package