Semiconductor package having step cut sawn into molding compound along perimeter of the semiconductor package
A semiconductor package includes a die attach pad; a plurality of lead terminals disposed around the die attach pad; a semiconductor die mounted on the die attach pad; a molding compound encapsulating the plurality of lead terminals, the semiconductor die, and the die attach pad; and a step cut sawn into the molding compound along a perimeter of a bottom surface of the semiconductor package. The step cut penetrates through an entire thickness of each of the plurality of lead terminals, whereby each of the plurality of lead terminals has at least an exposed outer end at the step cut.
1. A semiconductor package, comprising:
a die attach pad;
a plurality of lead terminals disposed around the die attach pad;
a semiconductor die mounted on the die attach pad;
a molding compound encapsulating the plurality of lead terminals, the semiconductor die, and the die attach pad; and
a step cut sawn into the molding compound along a perimeter of a bottom surface of the semiconductor package, wherein the step cut penetrates through an entire thickness of each of the plurality of lead terminals, whereby each of the plurality of lead terminals has at least an exposed outer end at the step cut, wherein a remaining portion of the molding compound masks an outer vertical side surface of each of the lead terminals.
2. The semiconductor package according to claim 1 , wherein the semiconductor die comprises a plurality of input/output (I/O) pads disposed along a perimeter of the semiconductor die, and wherein the plurality of I/O pads of the semiconductor die is electrically connected to the lead terminals by bond wires.
3. The semiconductor package according to claim 1 , wherein the semiconductor package has a thickness greater than 0.4 mm.
4. The semiconductor package according to claim 1 , wherein the step cut has a height greater than the thickness of each of the plurality of lead terminals, and a width of about 0.2-0.4 mm.
5. The semiconductor package according to claim 1 , wherein a bottom surface of the die attach pad is exposed from the bottom surface of the semiconductor package.
6. A printed circuit board assembly, comprising:
a printed circuit board comprising a chip-mounting face; and
a semiconductor package mounted on the chip-mounting face, wherein the semiconductor package has a rectangular outline, a top surface, a bottom surface, and four sidewalls between the top surface and the bottom surface, wherein the semiconductor package comprises:
a die attach pad;
a plurality of lead terminals disposed around the die attach pad;
a semiconductor die mounted on the die attach pad;
a molding compound encapsulating the plurality of lead terminals, the semiconductor die, and the die attach pad; and
a step cut sawn into the molding compound along a perimeter of the bottom surface of the semiconductor package, wherein the step cut penetrates through an entire thickness of each of the plurality of lead terminals, whereby each of the plurality of lead terminals has at least an exposed outer end at the step cut, wherein a remaining portion of the molding compound masks an outer vertical side surface of each of the lead terminals.
7. The printed circuit board assembly according to claim 6 , wherein a solder fillet is provided on the exposed outer end at the step cut.
8. The printed circuit board assembly according to claim 7 , wherein the solder fillet does not protrude beyond the four sidewalls of the semiconductor package.
9. The printed circuit board assembly according to claim 7 , wherein the solder fillet is in direct contact with the exposed outer end and has a half-spherical profile or a curved outer surface.
10. The printed circuit board assembly according to claim 7 , wherein the exposed outer end and the solder fillet are shaded by the molding compound at the step cut.