Patent Assignment
Reel/Frame 054059/0934
Assignment of Assignor's Interest
Recorded: 2020-10-15
Pages: 5
Assignors
JENG, SHIN-PUU
Executed: 2020-10-05
LIN, PO-YAO
Executed: 2020-10-05
CHEN, SHUO-MAO
Executed: 2020-10-05
LIN, CHIA-HSIANG
Executed: 2020-10-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure with Reinforced Element and Formation Method Thereof