IP Library › Assignment 054061/0213
Patent Assignment
Reel/Frame 054061/0213

Assignment of Assignor's Interest

Recorded: 2020-10-15 Pages: 3
Assignors
HWANG, DAUM
Executed: 2020-08-28
BAEK, SANGIN
Executed: 2020-08-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Adhesive Member, Manufacturing Method Thereof, and Electronic Device Including the Same
Application: 17/036,981 →
Publication: US 2021/0127514