Adhesive member, manufacturing method thereof, and electronic device including the same

1. An electronic device, comprising:

a housing comprising:

a front cover;

a rear cover facing in a direction opposite to the front cover and comprising a flat portion and a curved portion that extends with a specific curvature from the flat portion;

a lateral member surrounding a space between the front cover and the rear cover; and

a support member in an inner space thereof;

a conductive pattern disposed on the support member;

a cover member combined with the housing;

a first adhesive member disposed between the housing and the cover member to be overlapped at least in part with the conductive pattern, when the cover member is viewed from above;

a first masking film member attached to the first adhesive member and disposed between the first adhesive member and the conductive pattern to be overlapped with the conductive pattern when the cover member is viewed from above;

a second adhesive member disposed in a space between the curved portion and the lateral member; and

a second masking film member disposed from a part of the second adhesive member to an end of the second adhesive member adjacent to an end of the curved portion between the second adhesive member and the lateral member,

wherein a surface of the first masking film member facing the conductive pattern ncludes a photosensitive adhesive layer including a photo-initiator and having a reduced or removed adhesive force through irradiation of ultraviolet (UV) rays, and

wherein a surface of the second masking film member facing the lateral member includes a photosensitive adhesive layer configured to have a reduced or removed adhesive force through irradiation of UV rays so as to reduce a frictional force between the second adhesive member and the lateral member.

2. The electronic device of claim 1 , wherein further comprising

a printed circuit board (PCB) disposed in the inner space; and

a wireless communication circuit configured to at least one of transmit or receive a radio signal through the conductive pattern.

3. The electronic device of claim 2 , wherein the conductive pattern is electrically connected to the wireless communication circuit disposed on the PCB.

4. The electronic device of claim 1 , wherein the first adhesive member has a closed loop shape along an edge of the cover member.

5. The electronic deviceof claim 1 , wherein the fit adhesive member comprises:

an edge portion formed between the cover member and the housing along the edge of the cover member; and

an extended portion that extends from the edge portion to the support member,

wherein the first masking film member is attached to the extended portion.

6. The electronic device of claim 1 , further comprising a display disposed in the inner space to be visible from outside through the front cover.

7. The electronic device of claim 6 , further comprising a third adhesive member disposed between the support member and the display.

8. The electronic device of claim 7 , further cam ing a third masking film member disposed between the third adhesive member and the support member, and

wherein a surface a the third masking film member facing the support member includes a photosensitive adhesive layer containing a photo-initiator and having a reduced or removed adhesive force through irradiation of UV rays.

9. The electronic device of claim 8 , wherein the third adhesive member comprises:

an adhesive portion; and

a handle portion extended from the adhesive portion to detach the third adhesive member, and

wherein the third masking film member is formed on the handle portion.

10. The electronic device of claim 1 , wherein the photosensitive adhesive layer is colored through the irradiation of UV rays.