Patent Assignment
Reel/Frame 054066/0017
Inheritance System Table for Patent Application
Recorded: 2020-10-14
Pages: 13
Assignor
TSAI, CHUNG-CHE
Executed: 2020-03-20
Assignees
TSAI, SHIANN-TSONG
12F., NO.367, SEC. 2, GONGDAO 5TH RD., EAST DIST., HSINCHU CITY, TAIWAN
TSAI, HSIEN-CHOU
8F., NO. 38, LN. 168, SONGDE RD., XINYI DIST., TAIPEI CITY, TAIWAN
TSAI, HSIEN-WEI
3F., NO. 39, LN. 236, SEC. 5, ZHONGXIAO E. RD., XINYI DIST., TAIPEI CITY, TAIWAN
TSAI HUANG, YEN-MEI
13F, NO. 90, SONGKAO RD., XINYI DISTRICT, TAIPEI CITY, TAIWAN
Covered Property
(1)
Semiconductor Package with in-Package Compartmental Shielding and Fabrication Method Thereof