Patent Assignment
Reel/Frame 054077/0168
Assignment of Assignor's Interest
Recorded: 2020-10-16
Pages: 6
Assignors
KIM, HYEONG MOOK
Executed: 2020-10-13
JANG, KEUN SAM
Executed: 2020-10-13
KANG, DONG HUN
Executed: 2020-10-13
LEE, JONG WON
Executed: 2020-10-13
Assignee
SAMSUNG SDI CO., LTD.
150-20, GONGSE-RO, GIHEUNG-GU, YONGIN-SI, GYEONGGI-DO,, 17084, KOREA, REPUBLIC OF
Covered Property
(1)
Cmp Slurry Composition for Copper Films and Method of Polishing Copper Films Using the Same