Patent Assignment
Reel/Frame 054115/0776
Assignment of Assignor's Interest
Recorded: 2020-10-20
Pages: 4
Assignor
ISHIKAWA, SHINYA
Executed: 2020-09-29
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Method and Plasma Processing Apparatus