Patent Assignment
Reel/Frame 054144/0407
Assignment of Assignor's Interest
Recorded: 2020-10-22
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Manufacturing A Packaged Device With Optical Pathway