Patent Assignment
Reel/Frame 054170/0631
Assignment of Assignor's Interest
Recorded: 2020-10-26
Pages: 4
Assignors
HUNG, WENSEN
Executed: 2020-10-05
SHIH, HSUAN-NING
Executed: 2020-10-05
HU, HSIEN-PIN
Executed: 2020-10-05
LIN, TSUNG-SHU
Executed: 2020-10-05
CHEN, TSUNG-YU
Executed: 2020-10-05
WEI, WEN-HSIN
Executed: 2020-10-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Having Heat Dissipation Structure of Curved Profile and a Manufacturing Method Thereof